Inventor · disambiguated record
Hoko Kanazawa
Also filed as: KANAZAWA HOKO
4 granted patents·3 pending applications·95 citations·filing 1999–2010
80Inventor score
Top patents by PatentIndex Score
7 records- 0193US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0285US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 0378US7208105B2Adhesive for circuit connection, circuit connection method using the same, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 24, 2007·16 cites·13 claims
- 0477US8029911B2Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureHITACHI CHEMICAL CO LTD·Filed 2010·Granted Oct 4, 2011·4 cites·12 claims
- 0549US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 0648US2007166549A1Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureNOMURA SATOYUKI·Filed 2007·Application pending·0 cites
- 0748US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →