Wiring-connecting material and wiring-connected board production process using the same

Abstract

The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

1 . A wiring-connecting film provided between at least two wiring members, each wiring member having a connecting terminal and so disposed that the sides of the wiring members having the connecting terminals face each other, the wiring-connecting film interconnecting the wiring members so that the connecting terminals of the wiring members are able to provide an electrical connection between the wiring members by heating and applying a pressure,
 the wiring-connecting film comprising:   a radical polymerizable substance;   a curing agent generating a free radical upon heating;   at least one film-forming material; and   a polyurethane resin obtained by the reaction of a diol, having two hydroxyl groups in the molecule, with a diisocyanate, having two isocyanate groups in the molecule.   
     
     
         2 . A wiring-connecting film according to  claim 1 , which further comprises conductive particles. 
     
     
         3 . A wiring-connecting film according to  claim 1 , wherein the at least one film-forming material is selected from the group consisting of phenoxy resin and polyimide resin 
     
     
         4 . A process for producing a wiring-connected board, comprising:
 interconnecting wiring members each having a connecting terminal, said wiring members being so interconnected that their connecting terminals are able to make an electrical connection between the wiring members, said interconnecting comprising heating the wiring-connecting film according to  claim 1  while applying a pressure thereto via the wiring members, the wiring-connecting film being held between at least two wiring members so disposed that the sides of the wiring members having the connecting terminals face each other.   
     
     
         5 . The process for producing a wiring-connected board according to  claim 4 , wherein at least one of the connecting terminals has a surface formed of at least one metal selected from the group consisting of gold, silver and a platinum group metal.