Inventor · disambiguated record
Satoyuki Nomura
Also filed as: NOMURA SATOYUKI
22 granted patents·14 pending applications·160 citations·filing 1999–2024
94Inventor score
Files withHITACHI CHEMICAL CO LTD11NOMURA SATOYUKI8RESONAC CORP6FUJINAWA TOHRU2SHOWA DENKO MATERIALS CO LTD2
Top patents by PatentIndex Score
36 records- 0193US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0290US2025084294A1Slurry and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0390US2025129279A1Slurry, screening method, and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0489US2024425737A1Slurry, screening method, and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0588US8687263B2Light control filmNOMURA SATOYUKI·Filed 2010·Granted Apr 1, 2014·6 cites·4 claims
- 0688US7714099B2Luminescent compositions and their usesHITACHI CHEMICAL CO LTD·Filed 2004·Granted May 11, 2010·23 cites·84 claims
- 0785US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 0881US12104112B2Slurry, screening method, and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Oct 1, 2024·1 cites·19 claims
- 0978US7208105B2Adhesive for circuit connection, circuit connection method using the same, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 24, 2007·16 cites·13 claims
- 1077US8029911B2Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureHITACHI CHEMICAL CO LTD·Filed 2010·Granted Oct 4, 2011·4 cites·12 claims
- 1174US2025263593A1Abrasive grains and method for selecting same, polishing liquid, multi-liquid type polishing liquid, polishing method, component manufacturing method, and semiconductor component manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 1274US2025263594A1Raw material for obtaining abrasive grains and method for selecting same, abrasive grain production method, polishing solution production method, polishing method, component production method, and semiconductor component productionRESONAC CORP·Filed 2023·Application pending·0 cites
- 1374US2025257253A1Abrasive grain, selection method therefor, polishing agent, multi-liquid polishing agent, polishing method, component manufacturing method, and semiconductor component manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 1468US7955716B2Metal coordination compound, polymer composition, and organic electroluminescent device employing sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jun 7, 2011·11 cites·6 claims
- 1567US12173219B2Slurry and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Dec 24, 2024·0 cites·21 claims
- 1667US8154791B2Light control filmNOMURA SATOYUKI·Filed 2009·Granted Apr 10, 2012·2 cites·11 claims
- 1767US7507351B2Method for purifying electroluminescent material, electroluminescent material and electroluminescent deviceHITACHI CHEMICAL CO LTD·Filed 2004·Granted Mar 24, 2009·9 cites·9 claims
- 1865US10175551B2Light control filmNOMURA SATOYUKI·Filed 2010·Granted Jan 8, 2019·1 cites·23 claims
- 1964US8242235B2Purification process of electroluminescent material, electroluminescent material and electroluminescent deviceTSUDA YOSHIHIRO·Filed 2004·Granted Aug 14, 2012·7 cites·16 claims
- 2058US8520294B2Method for manufacturing light control particles and light control film using light control particles obtained by the methodTANAKA TOORU·Filed 2009·Granted Aug 27, 2013·0 cites·11 claims
- 2158US8008418B2High-molecular copolymer containing metal coordination compound and organic electroluminescence element using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Aug 30, 2011·5 cites·12 claims
- 2256US10288976B2Light control filmHITACHI CHEMICAL CO LTD·Filed 2014·Granted May 14, 2019·0 cites·14 claims
- 2353US2009163743A1Luminescence system, method of luminescence, and chemical substance for luminescenceHOSHI YOUSUKE·Filed 2009·Application pending·0 cites
- 2451US10156767B2Light control filmNOMURA SATOYUKI·Filed 2009·Granted Dec 18, 2018·0 cites·23 claims
- 2549US8681418B2Light control filmNOMURA SATOYUKI·Filed 2011·Granted Mar 25, 2014·0 cites·6 claims
- 2649US8570642B2Light control filmNOMURA SATOYUKI·Filed 2011·Granted Oct 29, 2013·0 cites·7 claims
- 2749US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 2848US2007166549A1Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureNOMURA SATOYUKI·Filed 2007·Application pending·0 cites
- 2948US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
- 3046US9983456B2Light control filmNOMURA SATOYUKI·Filed 2009·Granted May 29, 2018·0 cites·23 claims
- 3145US2007138945A1Luminescence system, method of luminescence, and chemical substance for luminescenceHITACHI CHIEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 3243US8075943B2Purification process for organic electronics materialTSUDA YOSHIHIRO·Filed 2005·Granted Dec 13, 2011·0 cites·2 claims
- 3342US10119049B2Polishing agent, storage solution for polishing agent and polishing methodHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·0 cites·12 claims
- 3442US2009036623A1Process for producing conjugated polymerHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 3541US2007027299A1Quinoline copolymer having branced structure and organic electroluminescent device employing sameMORISHITA YOSHII·Filed 2004·Application pending·0 cites
- 3641US2007003783A1Quinoline copolymer and organic electroluminescent device employing sameMAXDEM INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →