Inventor · disambiguated record
Kenzo Takemura
Also filed as: TAKEMURA KENZO
10 granted patents·1 pending application·386 citations·filing 1996–2011
91Inventor score
Top patents by PatentIndex Score
11 records- 0191US6223429B1Method of production of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1996·Granted May 1, 2001·145 cites·3 claims
- 0282US7879445B2Adhesive for bonding circuit members, circuit board and process for its productionHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·8 cites·9 claims
- 0382US6034331AConnection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1996·Granted Mar 7, 2000·60 cites·20 claims
- 0480US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 0578US6328844B1Filmy adhesive for connecting circuits and circuit boardHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·53 cites·26 claims
- 0672US6338195B1Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheetHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jan 15, 2002·37 cites·19 claims
- 0771US7247381B1Adhesive for bonding circuit members, circuit board, and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jul 24, 2007·21 cites·17 claims
- 0854US8252419B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Aug 28, 2012·0 cites·6 claims
- 0954US2009314533A1Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2009·Application pending·0 cites
- 1050US8273458B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 1150US8273457B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Kenzo Takemura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →