Inventor · disambiguated record
Kanji Ishibashi
Also filed as: ISHIBASHI KANJI
1 granted patent·2 pending applications·1 citations·filing 2016–2022
15Inventor score
Files withTOWA CORP3
Top patents by PatentIndex Score
3 records- 0151US9595483B2Cutting device and cutting methodTOWA CORP·Filed 2016·Granted Mar 14, 2017·1 cites·5 claims
- 0245US2024379383A1Semiconductor device and method for manufacturing the sameTOWA CORP·Filed 2022·Application pending·0 cites
- 0343US2024371658A1Semiconductor device manufacturing method and lead frameTOWA CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →