Inventor · disambiguated record
Kaoru Ishii
Also filed as: ISHII KAORU
16 granted patents·1 pending application·135 citations·filing 1979–2019
90Inventor score
Files withSHINETSU HANDOTAI KK7TEXAS INSTRUMENTS INC5CALSONIC KANSEI CORP1FUJIBO HOLDINGS INC1ISHII KAORU1
Top patents by PatentIndex Score
17 records- 0184US4949669AGas flow systems in CCVD reactorsTEXAS INSTRUMENTS INC·Filed 1988·Granted Aug 21, 1990·75 cites·7 claims
- 0275US10201886B2Polishing pad and method for manufacturing the sameFUJIBO HOLDINGS INC·Filed 2015·Granted Feb 12, 2019·2 cites·16 claims
- 0364US9981361B2Apparatus for dressing urethane foam pad for use in polishingSHINETSU HANDOTAI KK·Filed 2014·Granted May 29, 2018·1 cites·14 claims
- 0463US10850365B2Polishing apparatus with a waste liquid receiverSHINETSU HANDOTAI KK·Filed 2016·Granted Dec 1, 2020·1 cites·2 claims
- 0556US8808907B2Battery moduleMATSUO HIROTATSU·Filed 2011·Granted Aug 19, 2014·1 cites·8 claims
- 0655US9427931B2Production apparatus of skin-fitted foam molding member, production method of skin-fitted foam molding member, and skin-fitted foam molding memberNISSAN MOTOR·Filed 2013·Granted Aug 30, 2016·0 cites·4 claims
- 0752US9156226B2Production apparatus of skin-fitted foam molding member, production method of skin-fitted foam molding member, and skin-fitted foam molding memberISHII KAORU·Filed 2009·Granted Oct 13, 2015·0 cites·2 claims
- 0852US4325093AMagnetic head transducer having enhanced signal output and manufacturing method thereforTEXAS INSTRUMENTS INC·Filed 1979·Granted Apr 13, 1982·12 cites·14 claims
- 0946US4908495AHeating lamp assembly for ccvd reactorsTEXAS INSTRUMENTS INC·Filed 1988·Granted Mar 13, 1990·18 cites·19 claims
- 1044US10537972B2Polishing method and polishing apparatusSHINETSU HANDOTAI KK·Filed 2016·Granted Jan 21, 2020·0 cites·8 claims
- 1143US4941429ASemiconductor wafer carrier guide tracksTEXAS INSTRUMENTS INC·Filed 1988·Granted Jul 17, 1990·13 cites·17 claims
- 1242US9211667B2Method and device for molding soft and thin resin molded productCALSONIC KANSEI CORP·Filed 2013·Granted Dec 15, 2015·0 cites·8 claims
- 1341US2021023673A1Polishing head and wafer polishing methodSHINETSU HANDOTAI KK·Filed 2019·Application pending·0 cites
- 1440US10300576B2Polishing methodSHINETSU HANDOTAI KK·Filed 2016·Granted May 28, 2019·0 cites·17 claims
- 1538US5074736ASemiconductor wafer carrier designTEXAS INSTRUMENTS INC·Filed 1990·Granted Dec 24, 1991·12 cites·5 claims
- 1636US10532442B2Polishing apparatus and wafer polishing methodSHINETSU HANDOTAI KK·Filed 2015·Granted Jan 14, 2020·0 cites·8 claims
- 1732US10414017B2Polishing apparatusSHINETSU HANDOTAI KK·Filed 2015·Granted Sep 17, 2019·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →