Inventor · disambiguated record
Kazutoshi Iwai
Also filed as: IWAI Kazutoshi
12 granted patents·4 pending applications·5 citations·filing 2012–2022
82Inventor score
Top patents by PatentIndex Score
16 records- 0175US10731256B2Plating apparatus, plating method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 4, 2020·2 cites·6 claims
- 0270US11519074B2Plating method and recording mediumTOKYO ELECTRON LTD·Filed 2020·Granted Dec 6, 2022·0 cites·3 claims
- 0368US9428835B2Cobalt base film-forming method, cobalt base film-forming material, and novel compoundGAS-PHASE GROWTH LTD·Filed 2012·Granted Aug 30, 2016·2 cites·11 claims
- 0463US9966306B2Catalyst layer forming method, catalyst layer forming system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 8, 2018·1 cites·13 claims
- 0556US11004684B2Forming method of hard maskTOKYO ELECTRON LTD·Filed 2019·Granted May 11, 2021·0 cites·4 claims
- 0653US10224202B2Forming method of hard mask, forming apparatus of hard mask and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 0752US9650717B2Pre-treatment method of plating, storage medium, and plating systemTOKYO ELECTRON LTD·Filed 2015·Granted May 16, 2017·0 cites·5 claims
- 0851US2024309511A1Plating method and plating apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0950US9523153B2Pre-treatment method for plating and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted Dec 20, 2016·0 cites·6 claims
- 1045US10784111B2Plating method, plating apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Sep 22, 2020·0 cites·3 claims
- 1145US2022290302A1Substrate liquid processing method, substrate liquid processing apparatus, and computer-readable recording mediumTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 1244US10755973B2Metal wiring layer forming method, metal wiring layer forming apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 25, 2020·0 cites·8 claims
- 1343US11230767B2Plating method, plating apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Jan 25, 2022·0 cites·4 claims
- 1442US11028483B2Plating method, plating apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Jun 8, 2021·0 cites·5 claims
- 1538US2021108316A1Plating method, plating system, and recording mediumTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 1635US2016247765A1Semiconductor device, plating method, plating system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →