Inventor · disambiguated record
Kathryn Keswick
Also filed as: KESWICK KATHRYN · KESWICK KATHRYN V
1 granted patent·2 pending applications·211 citations·filing 1994–2008
56Inventor score
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3 records- 0191US5508228ACompliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming sameMICROELECTRONICS & COMPUTER·Filed 1994·Granted Apr 16, 1996·211 cites·37 claims
- 0245US2009293907A1Method of substrate polymer removalFUNG NANCY·Filed 2008·Application pending·0 cites
- 0342US2010330805A1Methods for forming high aspect ratio features on a substrateDOAN KENNY LINH·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →