Inventor · disambiguated record
Kazuyuki Kohara
Also filed as: KOHARA KAZUYUKI
10 granted patents·140 citations·filing 1995–2016
87Inventor score
Files withNAMICS CORP4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2PANASONIC CORP2HANADA MASAKI1SUMITOMO RUBBER IND1
Top patents by PatentIndex Score
10 records- 0193US7049559B2Flexible PTC heating element and method of manufacturing the heating elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 23, 2006·80 cites·8 claims
- 0291US7675004B2Heating element and production method thereofPANASONIC CORP·Filed 2005·Granted Mar 9, 2010·29 cites·50 claims
- 0381US8367987B2Flexible PTC heating element and method of manufacturing the heating elementPANASONIC CORP·Filed 2006·Granted Feb 5, 2013·6 cites·8 claims
- 0477US9805998B2Liquid sealing material and electronic component using sameNAMICS CORP·Filed 2013·Granted Oct 31, 2017·4 cites·18 claims
- 0567US9204496B2Planar heating element and manufacturing method for sameHANADA MASAKI·Filed 2011·Granted Dec 1, 2015·3 cites·9 claims
- 0649US9748158B2Liquid sealing material and electronic component using sameNAMICS CORP·Filed 2016·Granted Aug 29, 2017·0 cites·24 claims
- 0749US7366578B2Method, program and system for designing shape of product, such as a tireSUMITOMO RUBBER IND·Filed 2005·Granted Apr 29, 2008·0 cites·6 claims
- 0846US6198377B1Plastic thermistor and thermosensitive device comprising the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Mar 6, 2001·18 cites·30 claims
- 0943US10196513B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Feb 5, 2019·0 cites·15 claims
- 1042US9947604B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Apr 17, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →