Inventor · disambiguated record
Katie Lutker-Lee
Also filed as: Lutker-Lee Katie
19 granted patents·8 pending applications·13 citations·filing 2016–2024
88Inventor score
Files withTOKYO ELECTRON LTD27
Top patents by PatentIndex Score
27 records- 0187US9607834B2Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)TOKYO ELECTRON LTD·Filed 2016·Granted Mar 28, 2017·5 cites·20 claims
- 0286US9818610B2Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)TOKYO ELECTRON LTD·Filed 2017·Granted Nov 14, 2017·4 cites·7 claims
- 0382US11978631B2Forming contact holes with controlled local critical dimension uniformityTOKYO ELECTRON LTD·Filed 2020·Granted May 7, 2024·1 cites·22 claims
- 0479US11837471B2Methods of patterning small featuresTOKYO ELECTRON LTD·Filed 2020·Granted Dec 5, 2023·1 cites·18 claims
- 0577US10304725B2Manufacturing methods to protect ULK materials from damage during etch processing to obtain desired featuresTOKYO ELECTRON LTD·Filed 2017·Granted May 28, 2019·2 cites·25 claims
- 0666US12506005B2Methods and structures for increasing stability of soft or organic featuresTOKYO ELECTRON LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0765US2025224677A1Selective deposition on metal-containing mask using promoterTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0861US12469701B2Patterning features with metal based resistsTOKYO ELECTRON LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0960US2025298307A1Method for patterning mask layer using metal-containing resistTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1059US12334391B2Method for patterning a substrate using photolithographyTOKYO ELECTRON LTD·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 1159US2025308896A1Multiple patterning utilizing a two-color spacer designTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1258US12100591B2Photoactive metal-based hard mask integrationTOKYO ELECTRON LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 1358US2025305149A1Etching bi-metal oxides with alkaline earth metalsTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1457US2025253152A1Direct current superposition (dcs) for protection of organic mandrel during spacer depositionTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1557US2025306463A1Patterning a substrate using a multi-patterning techniqueTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1656US12438006B2Metal hard mask integrationTOKYO ELECTRON LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1756US12322597B2Pitch scaling in microfabricationTOKYO ELECTRON LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1855US12451354B2Double patterning method of patterning a substrateTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·16 claims
- 1954US11882776B2In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cellsTOKYO ELECTRON LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 2053US12009211B2Method for highly anisotropic etching of titanium oxide spacer using selective top-depositionTOKYO ELECTRON LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 2151US12451353B2Double hardmasks for self-aligned multi-patterning processesTOKYO ELECTRON LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2249US11621164B2Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposesTOKYO ELECTRON LTD·Filed 2020·Granted Apr 4, 2023·0 cites·20 claims
- 2348US11361993B2Method for inverse via patterning for back end of line dual damascene structuresTOKYO ELECTRON LTD·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 2447US11756790B2Method for patterning a dielectric layerTOKYO ELECTRON LTD·Filed 2021·Granted Sep 12, 2023·0 cites·6 claims
- 2546US2023081862A1Focus Ring RegenerationTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2645US11410852B2Protective layers and methods of formation during plasma etching processesTOKYO ELECTRON LTD·Filed 2019·Granted Aug 9, 2022·0 cites·25 claims
- 2745US2022037152A1Plasma Pre-Treatment Method To Improve Etch Selectivity And Defectivity MarginTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →