Inventor · disambiguated record
Karen P. Mclaughlin
Also filed as: MCLAUGHLIN KAREN P · MCLAUGHLIN KAREN PATRICIA
10 granted patents·1 pending application·157 citations·filing 1997–2020
88Inventor score
Top patents by PatentIndex Score
11 records- 0197US9401336B2Dual layer stack for contact formationIBM·Filed 2014·Granted Jul 26, 2016·48 cites·17 claims
- 0282US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 0382US8937009B2Far back end of the line metallization method and structuresIBM·Filed 2013·Granted Jan 20, 2015·6 cites·18 claims
- 0476US5896869ASemiconductor package having etched-back silver-copper brazeIBM·Filed 1997·Granted Apr 27, 1999·51 cites·11 claims
- 0566US5869139AApparatus and method for plating pin grid array packaging modulesIBM·Filed 1997·Granted Feb 9, 1999·40 cites·8 claims
- 0653US9214385B2Semiconductor device including passivation layer encapsulantIBM·Filed 2014·Granted Dec 15, 2015·0 cites·11 claims
- 0750US11121101B2Flip chip packaging reworkIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 0848US10957650B2Bridge support structureIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 0945US2016035641A1Semiconductor device including passivation layer encapsulantGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 1039US5935404AMethod of performing processes on features with electricityIBM·Filed 1997·Granted Aug 10, 1999·7 cites·10 claims
- 1132US5985128AMethod of performing processes on features with electricityIBM·Filed 1999·Granted Nov 16, 1999·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →