Inventor · disambiguated record
Kazuya Okubo
Also filed as: OKUBO KAZUYA
29 granted patents·12 pending applications·187 citations·filing 1991–2024
95Inventor score
Files withTOKYO ELECTRON LTD10TORAY INDUSTRIES7AKIYAMA SHINICHI4SOCIONEXT INC4FUJITSU SEMICONDUCTOR LTD3
Top patents by PatentIndex Score
41 records- 0192US9551068B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Jan 24, 2017·12 cites·11 claims
- 0286US12284833B2Semiconductor device and protection circuit including diode and buried wiringSOCIONEXT INC·Filed 2021·Granted Apr 22, 2025·1 cites·25 claims
- 0386US6251188B1Apparatus for forming laminated thin films or layersTOKYO ELECTRON LTD·Filed 1999·Granted Jun 26, 2001·60 cites·5 claims
- 0485US6022586AMethod and apparatus for forming laminated thin films or layersTOKYO ELECTRON LTD·Filed 1998·Granted Feb 8, 2000·54 cites·11 claims
- 0583US9074096B2Polyphenylene sulfide resin composition and molding comprising sameOKUBO KAZUYA·Filed 2012·Granted Jul 7, 2015·5 cites·4 claims
- 0682US12162346B2Working vehicleKUBOTA KK·Filed 2023·Granted Dec 10, 2024·1 cites·11 claims
- 0778US12199089B2Semiconductor deviceSOCIONEXT INC·Filed 2024·Granted Jan 14, 2025·0 cites·15 claims
- 0877US12233960B2Working vehicleKUBOTA KK·Filed 2023·Granted Feb 25, 2025·0 cites·9 claims
- 0976US6913996B2Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiringTOKYO ELECTRON LTD·Filed 2001·Granted Jul 5, 2005·20 cites·34 claims
- 1075US8551832B2Method for manufacturing semiconductor deviceAKIYAMA SHINICHI·Filed 2010·Granted Oct 8, 2013·3 cites·11 claims
- 1174US9823180B2Method for measuring resistance of conveyor belt to getting over support roller, and device thereforYOKOHAMA RUBBER CO LTD·Filed 2013·Granted Nov 21, 2017·2 cites·12 claims
- 1273US8338953B2Method of manufacturing a semiconductor device and semiconductor deviceAKIYAMA SHINICHI·Filed 2011·Granted Dec 25, 2012·2 cites·4 claims
- 1372US11551930B2Methods to reshape spacer profiles in self-aligned multiple patterningTOKYO ELECTRON LTD·Filed 2019·Granted Jan 10, 2023·1 cites·25 claims
- 1469US11967593B2Semiconductor deviceSOCIONEXT INC·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 1569US8148262B2Method for manufacturing semiconductor deviceAKIYAMA SHINICHI·Filed 2010·Granted Apr 3, 2012·3 cites·11 claims
- 1664US8030207B2Method of manufacturing a semiconductor device and semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Oct 4, 2011·1 cites·10 claims
- 1762US2024174859A1Plated molding, method of producing plated molding, and housing componentTORAY INDUSTRIES·Filed 2022·Application pending·0 cites
- 1860US2023407090A1Polyphenylene sulfide resin composition and molded articleTORAY INDUSTRIES·Filed 2021·Application pending·0 cites
- 1959US2022380598A1Polyphenylene sulfide resin composition for automotive cooling parts, and automotive cooling partsTORAY INDUSTRIES·Filed 2020·Application pending·0 cites
- 2059US2022403111A1Polyphenylene sulfide resin compositon for automotive cooling parts, and automotive cooling partsTORAY INDUSTRIES·Filed 2020·Application pending·0 cites
- 2156US12234326B2Polyphenylene sulfide resin composition and molded articleTORAY INDUSTRIES·Filed 2020·Granted Feb 25, 2025·0 cites·7 claims
- 2256US11241818B2Pipe-shaped integrally molded article and production method for pipe-shaped integrally molded articleTORAY INDUSTRIES·Filed 2019·Granted Feb 8, 2022·0 cites·6 claims
- 2355US12304183B2Flame-resistant layered molded articleTORAY INDUSTRIES·Filed 2020·Granted May 20, 2025·0 cites·14 claims
- 2455US8536708B2Method of manufacturing a semiconductor device and semiconductor deviceAKIYAMA SHINICHI·Filed 2012·Granted Sep 17, 2013·0 cites·8 claims
- 2553US8889505B2Method for manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Nov 18, 2014·0 cites·2 claims
- 2650US2025250472A1Resin composition for adhesive layer, and multilayer tubePOLYPLASTICS EVONIK CORP·Filed 2022·Application pending·0 cites
- 2748US2009316332A1Semiconductor device containing thin film capacitor and manufacture method for thin film capacitorFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 2845US6404021B1Laminated structure and a method of forming the sameTOKYO ELECTRON LTD·Filed 1998·Granted Jun 11, 2002·8 cites·8 claims
- 2944US9188177B2Brake discFUJII TORU·Filed 2012·Granted Nov 17, 2015·0 cites·9 claims
- 3044US7592256B2Method of forming tungsten filmTOKYO ELECTRON LTD·Filed 2002·Granted Sep 22, 2009·1 cites·32 claims
- 3143US2019081032A1Semiconductor deviceSOCIONEXT INC·Filed 2018·Application pending·0 cites
- 3243US2009075477A1Method of manufacturing semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2008·Application pending·0 cites
- 3342US6245673B1Method of forming tungsten silicide filmTOKYO ELECTRON LTD·Filed 1999·Granted Jun 12, 2001·7 cites·13 claims
- 3441US2020254964A1Pretensioner and seat belt apparatusJOYSON SAFETY SYSTEMS JAPAN KK·Filed 2018·Application pending·0 cites
- 3539US8575704B2Semiconductor device and manufacturing method of the semiconductor deviceHANEDA MASAKI·Filed 2012·Granted Nov 5, 2013·0 cites·14 claims
- 3639US6821874B2Method for depositing tungsten silicide film and method for preparing gate electrode/wiringTOKYO ELECTRON LTD·Filed 2001·Granted Nov 23, 2004·0 cites·20 claims
- 3738US2009085130A1Semiconductor deviceSUZUKI KENJI·Filed 2005·Application pending·0 cites
- 3837US6489208B2Method of forming a laminated structure to enhance metal silicide adhesion on polycrystalline siliconTOKYO ELECTRON LTD·Filed 2002·Granted Dec 3, 2002·0 cites·37 claims
- 3936US2011169105A1Semiconductor device and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2011·Application pending·0 cites
- 4033US5300520AWood preservative compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1991·Granted Apr 5, 1994·6 cites·3 claims
- 4132US2005189652A1Method for fabricating a silicide film, multilayered intermediate structure and multilayered structureUNIV NAGOYA NAT UNIV CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →