Inventor · disambiguated record
Katsuhiko Oshimi
Also filed as: OSHIMI KATSUHIKO
8 granted patents·8 pending applications·37 citations·filing 1998–2011
82Inventor score
Top patents by PatentIndex Score
16 records- 0176US7521100B2Liquid crystal sealing agent and liquid crystalline display cell using the sameNIPPON KAYAKU KK·Filed 2004·Granted Apr 21, 2009·18 cites·22 claims
- 0269US8198381B2Phenol aralkyl epoxy resin with secondary hydroxyl groupsNAKANISHI MASATAKA·Filed 2006·Granted Jun 12, 2012·2 cites·4 claims
- 0366US8981160B2Modified liquid epoxy resin as well as epoxy resin composition using the same and cured product thereofNAKANISHI MASATAKA·Filed 2007·Granted Mar 17, 2015·2 cites·3 claims
- 0451US6812318B2Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the sameNIPPON KAYAKU KK·Filed 2001·Granted Nov 2, 2004·2 cites·5 claims
- 0548US7884172B2Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethaneNIPPON KAYAKU KK·Filed 2006·Granted Feb 8, 2011·0 cites·6 claims
- 0648US6420464B1Polyhydric phenol compounds, epoxy resins, epoxy resin compositions and cured products thereofNIPPON KAYAKU KK·Filed 1998·Granted Jul 16, 2002·11 cites·7 claims
- 0747US7968672B2Phenolic resin, process for production thereof, epoxy resin, and use thereofNIPPON KAYAKU KK·Filed 2006·Granted Jun 28, 2011·0 cites·13 claims
- 0846US2008032154A1Epoxy Resin, Epoxy Resin Composition and Cured Product ThereofAKATSUKA YASUMASA·Filed 2005·Application pending·0 cites
- 0945US2009054587A1Epoxy resin, epoxy resin composition, and prepreg and laminated plate using the epoxy resin compositionNIPPON KAYAKU KK·Filed 2006·Application pending·0 cites
- 1044US6723801B2Polyphenol resin, process for its production, epoxy resin composition and its useNIPPON KAYAKU KK·Filed 2001·Granted Apr 20, 2004·2 cites·1 claims
- 1142US2008153976A1Epoxy Resin, Epoxy Resin Composition, And Cured Material ThereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 1241US2008021173A1Epoxy Resin, Epoxy Resin Composition And Cured Product ThereofNAKANISHI MASATAKA·Filed 2005·Application pending·0 cites
- 1340US2008200636A1Epoxy Resin, Hardenable Resin Composition Containing the Same and Use ThereofNAKANISHI MASATAKA·Filed 2006·Application pending·0 cites
- 1435US2004166326A1Polyphenol resin, method for producing the same, epoxy resin composition and use thereofFiled 2004·Application pending·0 cites
- 1535US2008076900A1Epoxy Resin Composition for Optical Semiconductor EncapsulationOSHIMI KATSUHIKO·Filed 2005·Application pending·0 cites
- 1630US2012296011A1Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereofKAWAI KOUICHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →