Inventor · disambiguated record
Kapu Sirish Reddy
Also filed as: Reddy Kapu Sirish
17 granted patents·14 pending applications·463 citations·filing 2016–2025
93Inventor score
Files withLAM RES CORP31
Top patents by PatentIndex Score
31 records- 0197US10665501B2Deposition of Aluminum oxide etch stop layersLAM RES CORP·Filed 2017·Granted May 26, 2020·22 cites·16 claims
- 0296US9859153B1Deposition of aluminum oxide etch stop layersLAM RES CORP·Filed 2016·Granted Jan 2, 2018·19 cites·20 claims
- 0396US9847221B1Low temperature formation of high quality silicon oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2016·Granted Dec 19, 2017·389 cites·20 claims
- 0494US10559461B2Selective deposition with atomic layer etch resetLAM RES CORP·Filed 2017·Granted Feb 11, 2020·10 cites·7 claims
- 0593US10566194B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2018·Granted Feb 18, 2020·5 cites·20 claims
- 0687US11094542B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2020·Granted Aug 17, 2021·2 cites·20 claims
- 0786US10049869B2Composite dielectric interface layers for interconnect structuresLAM RES CORP·Filed 2016·Granted Aug 14, 2018·4 cites·11 claims
- 0884US10472716B1Showerhead with air-gapped plenums and overhead isolation gas distributorLAM RES CORP·Filed 2018·Granted Nov 12, 2019·4 cites·20 claims
- 0984US10418236B2Composite dielectric interface layers for interconnect structuresLAM RES CORP·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 1081US12266535B2Mask encapsulation to prevent degradation during fabrication of high aspect ratio featuresLAM RES CORP·Filed 2020·Granted Apr 1, 2025·1 cites·20 claims
- 1181US10998187B2Selective deposition with atomic layer etch resetLAM RES CORP·Filed 2019·Granted May 4, 2021·2 cites·9 claims
- 1274US10643889B2Pre-treatment method to improve selectivity in a selective deposition processLAM RES CORP·Filed 2018·Granted May 5, 2020·2 cites·19 claims
- 1371US11869770B2Selective deposition of etch-stop layer for enhanced patterningLAM RES CORP·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 1469US10804144B2Deposition of aluminum oxide etch stop layersLAM RES CORP·Filed 2020·Granted Oct 13, 2020·0 cites·14 claims
- 1564US2025191926A1Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layersLAM RES CORP·Filed 2025·Application pending·0 cites
- 1660US12249514B2Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layersLAM RES CORP·Filed 2020·Granted Mar 11, 2025·0 cites·16 claims
- 1757US10745806B2Showerhead with air-gapped plenums and overhead isolation gas distributorLAM RES CORP·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1856US2023167545A1Stabilization of carbon deposition precursors like c2h2LAM RES CORP·Filed 2021·Application pending·0 cites
- 1953US2025054760A1Carbon mask depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 2053US2024410760A1Thermal imaging for analysis of device fabrication toolsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2151US2023268192A1In-situ hydrocarbon-based layer for non-conformal passivation of partially etched structuresLAM RES CORP·Filed 2022·Application pending·0 cites
- 2251US2024234112A1Image analysis of plasma conditionsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2350US2025316474A1High modulus carbon doped silicon oxide film for mold stack scaling solutions in advanced memory applicationsLAM RES CORP·Filed 2023·Application pending·0 cites
- 2450US2025308894A1Hardmask for high aspect ratio dielectric etch at cryo and elevated temperaturesLAM RES CORP·Filed 2023·Application pending·0 cites
- 2549US2025357135A1High aspect ratio etch with a metal or metalloid containing maskLAM RES CORP·Filed 2023·Application pending·0 cites
- 2648US2023112746A1High modulus boron-based ceramics for semiconductor applicationsLAM RES CORP·Filed 2021·Application pending·0 cites
- 2746US2025104982A1Monitoring and control of plasma-based processesLAM RES CORP·Filed 2022·Application pending·0 cites
- 2845US2024030028A1High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacingLAM RES CORP·Filed 2021·Application pending·0 cites
- 2945US2023360922A1Robust ashable hard maskLAM RES CORP·Filed 2021·Application pending·0 cites
- 3041US2023357921A1Deposition rate enhancement of amorphous carbon hard mask film by purely chemical meansLAM RES CORP·Filed 2021·Application pending·0 cites
- 3139US10651080B2Oxidizing treatment of aluminum nitride films in semiconductor device manufacturingLAM RES CORP·Filed 2016·Granted May 12, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →