Inventor · disambiguated record
Katsuyuki Sakuma
Also filed as: SAKUMA KATSUYUKI
74 granted patents·24 pending applications·215 citations·filing 2002–2024
98Inventor score
Top patents by PatentIndex Score
98 records- 0194US9607973B1Method for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2015·Granted Mar 28, 2017·10 cites·10 claims
- 0293US11631650B2Solder transfer integrated circuit packagingIBM·Filed 2021·Granted Apr 18, 2023·2 cites·8 claims
- 0392US11973058B2Multiple die assemblyIBM·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 0492US9860996B2Selective area heating for 3D chip stackIBM·Filed 2016·Granted Jan 2, 2018·6 cites·12 claims
- 0592US9822002B1Flexible electronics for wearable healthcare sensorsIBM·Filed 2016·Granted Nov 21, 2017·5 cites·20 claims
- 0692US9373590B1Integrated circuit bonding with interposer dieIBM·Filed 2014·Granted Jun 21, 2016·9 cites·20 claims
- 0791US9670061B1Flexible electronics for wearable healthcare sensorsIBM·Filed 2016·Granted Jun 6, 2017·4 cites·10 claims
- 0890US10002835B2Structure for establishing interconnects in packages using thin interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·6 cites·8 claims
- 0990US8870051B2Flip chip assembly apparatus employing a warpage-suppressor assemblyBROFMAN PETER J·Filed 2012·Granted Oct 28, 2014·15 cites·25 claims
- 1090US6937233B2Liquid crystal displayIBM·Filed 2002·Granted Aug 30, 2005·42 cites·14 claims
- 1189US11404379B2Structure and method for bridge chip assembly with capillary underfillIBM·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 1289US11197773B2Intraoral device control systemIBM·Filed 2020·Granted Dec 14, 2021·4 cites·20 claims
- 1388US10262970B2Selective area heating for 3D chip stackIBM·Filed 2016·Granted Apr 16, 2019·4 cites·5 claims
- 1488US9105629B2Selective area heating for 3D chip stackIBM·Filed 2013·Granted Aug 11, 2015·6 cites·15 claims
- 1587US11824037B2Assembly of a chip to a substrateIBM·Filed 2020·Granted Nov 21, 2023·2 cites·4 claims
- 1687US9875986B2Micro-scrub process for fluxless micro-bump bondingIBM·Filed 2016·Granted Jan 23, 2018·6 cites·12 claims
- 1787US9431366B2Selective area heating for 3D chip stackIBM·Filed 2015·Granted Aug 30, 2016·4 cites·19 claims
- 1886US10419860B2Eye-mounted hearing aidIBM·Filed 2017·Granted Sep 17, 2019·4 cites·12 claims
- 1986US9330946B1Method and structure of die stacking using pre-applied underfillIBM·Filed 2015·Granted May 3, 2016·5 cites·21 claims
- 2084US9543273B2Reduced volume interconnect for three-dimensional chip stackIBM·Filed 2015·Granted Jan 10, 2017·4 cites·13 claims
- 2183US11527462B2Circuit substrate with mixed pitch wiringIBM·Filed 2019·Granted Dec 13, 2022·3 cites·11 claims
- 2283US10433078B2Eye-mounted hearing aidIBM·Filed 2017·Granted Oct 1, 2019·3 cites·8 claims
- 2383US9633925B1Visualization of alignment marks on a chip covered by a pre-applied underfillGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 2483US9263378B1Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2014·Granted Feb 16, 2016·4 cites·16 claims
- 2583US8759963B2Underfill material dispensing for stacked semiconductor chipsIBM·Filed 2013·Granted Jun 24, 2014·5 cites·7 claims
- 2682US9875985B2Flip-chip bonder with induction coils and a heating elementIBM·Filed 2014·Granted Jan 23, 2018·6 cites·16 claims
- 2781US11076246B2Eye-mounted hearing aidIBM·Filed 2019·Granted Jul 27, 2021·2 cites·20 claims
- 2881US10249559B2Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2016·Granted Apr 2, 2019·2 cites·2 claims
- 2979US11268867B2Strain gauge structure for a sensorIBM·Filed 2017·Granted Mar 8, 2022·2 cites·18 claims
- 3079US9385039B2Formation of through-silicon via (TSV) in silicon substrateSAKUMA KATSUYUKI·Filed 2014·Granted Jul 5, 2016·4 cites·1 claims
- 3179US7088324B2Liquid crystal display driver and method thereofIBM·Filed 2002·Granted Aug 8, 2006·20 cites·18 claims
- 3277US9852960B2Underfill dispensing using funnelsIBM·Filed 2016·Granted Dec 26, 2017·2 cites·18 claims
- 3376US9679875B2Reduced volume interconnect for three-dimensional chip stackIBM·Filed 2016·Granted Jun 13, 2017·2 cites·5 claims
- 3475US12290384B2Two-layer adhesion of electronics to a surfaceIBM·Filed 2022·Granted May 6, 2025·0 cites·17 claims
- 3574US8987131B2Formation of through-silicon via (TSV) in silicon substrateSAKUMA KATSUYUKI·Filed 2012·Granted Mar 24, 2015·3 cites·1 claims
- 3671US10249516B2Underfill dispensing using funnelsIBM·Filed 2017·Granted Apr 2, 2019·1 cites·11 claims
- 3771US2024050039A1Modular sensing unitIBM·Filed 2023·Application pending·0 cites
- 3870US11015913B2Flexible electronics for wearable healthcare sensorsIBM·Filed 2019·Granted May 25, 2021·0 cites·7 claims
- 3970US8978960B2Flip chip assembly apparatus employing a warpage-suppressor assemblyIBM·Filed 2014·Granted Mar 17, 2015·2 cites·15 claims
- 4068US2023230947A1Solder transfer integrated circuit packagingIBM·Filed 2023·Application pending·0 cites
- 4166US7514290B1Chip-to-wafer integration technology for three-dimensional chip stackingIBM·Filed 2008·Granted Apr 7, 2009·3 cites·1 claims
- 4265US11246496B2Heart rate and blood pressure monitoring biosensorsIBM·Filed 2018·Granted Feb 15, 2022·1 cites·6 claims
- 4365US10679931B2Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2019·Granted Jun 9, 2020·0 cites·20 claims
- 4465US8523632B2Blasting method and apparatus having abrasive recovery system, processing method of thin-film solar cell panel, and thin-film solar cell panel processed by the methodMASE KEIJI·Filed 2009·Granted Sep 3, 2013·3 cites·26 claims
- 4564US12300615B2Infrared debond damage mitigation by copper fill patternIBM·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4663US11850068B2Modular sensing unitIBM·Filed 2019·Granted Dec 26, 2023·0 cites·10 claims
- 4762US10280077B2Flexible electronics for wearable healthcare sensorsIBM·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 4862US2025349798A1Multiple chip module with integrated microchannel coolingIBM·Filed 2024·Application pending·0 cites
- 4961US9059241B23D assembly for interposer bowIBM·Filed 2013·Granted Jun 16, 2015·1 cites·10 claims
- 5061US2024320605A1Load aware stacking and packaging of itemsIBM·Filed 2023·Application pending·0 cites
Showing the top 50 of 98 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →