Inventor · disambiguated record
Kazuo Sakuma
Also filed as: SAKUMA KAZUO
18 granted patents·5 pending applications·351 citations·filing 1983–2023
94Inventor score
Files withTESSERA INC8ADEIA SEMICONDUCTOR SOLUTIONS LLC2SAKUMA KAZUO2TOKYO SHIBAURA ELECTRIC CO2INVENSAS CORP1
Top patents by PatentIndex Score
23 records- 0198US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 0298US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 0398US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 0497US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 0591US10062661B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2017·Granted Aug 28, 2018·5 cites·14 claims
- 0690US9318460B2Substrate and assembly thereof with dielectric removal for increased post heightTESSERA INC·Filed 2014·Granted Apr 19, 2016·8 cites·18 claims
- 0787US8884432B2Substrate and assembly thereof with dielectric removal for increased post heightSAKUMA KAZUO·Filed 2011·Granted Nov 11, 2014·9 cites·34 claims
- 0885US11424211B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA LLC·Filed 2020·Granted Aug 23, 2022·1 cites·29 claims
- 0977US10593643B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2018·Granted Mar 17, 2020·1 cites·14 claims
- 1076US8637992B2Flip chip package for DRAM with two underfill materialsSAKUMA KAZUO·Filed 2011·Granted Jan 28, 2014·4 cites·33 claims
- 1172US12494453B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 1272US10833044B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 1370US9691731B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 1468USD846809SHelmetYAMABIKO CORP·Filed 2017·Granted Apr 23, 2019·16 cites·1 claims
- 1564US8951845B2Methods of fabricating a flip chip package for dram with two underfill materialsINVENSAS CORP·Filed 2014·Granted Feb 10, 2015·1 cites·20 claims
- 1657US2004105869A1Methods for cultivation of Kabanoanatake secreting and containing active ingredients for prophylactic and therapeutic agents against microbe-related syndromes including HIVFiled 2003·Application pending·0 cites
- 1754US9666450B2Substrate and assembly thereof with dielectric removal for increased post heightTESSERA INC·Filed 2016·Granted May 30, 2017·0 cites·16 claims
- 1853US2003161841A1Preventive and therapeutic agents for microbe-related syndromes including HIVFiled 2002·Application pending·0 cites
- 1940US2003055007A1Antimicrobial agentsFiled 2001·Application pending·0 cites
- 2037US4509035AHumidity-sensitive element and process for producing the sameTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Apr 2, 1985·7 cites·7 claims
- 2134US2007221329A1Apparatus and method for distributing a liquid onto a surface of an itemTESSERA INTERCONNECT MATERIALS·Filed 2006·Application pending·0 cites
- 2232US2005097727A1Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardFiled 2002·Application pending·0 cites
- 2331US4529540AHumidity-sensitive resistive elementTOKYO SHIBAURA ELECTRIC CO·Filed 1984·Granted Jul 16, 1985·3 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Kazuo Sakuma files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →