Inventor · disambiguated record
Karine Saxod
Also filed as: SAXOD KARINE
25 granted patents·13 pending applications·25 citations·filing 2012–2025
92Inventor score
Files withST MICROELECTRONICS GRENOBLE 228ST MICROELECTRONICS INT NV5STMICROELECTRONICS (GRENOBLE 2) SAS5
Top patents by PatentIndex Score
38 records- 0193US11688815B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jun 27, 2023·4 cites·22 claims
- 0291US12066678B2Method of fabricating an electronic device comprising an optical chipST MICROELECTRONICS GRENOBLE 2·Filed 2023·Granted Aug 20, 2024·2 cites·11 claims
- 0389US9773740B2Stacked electronic device including a protective wafer bonded to a chip by an infused adhesiveSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2015·Granted Sep 26, 2017·7 cites·9 claims
- 0486US9472692B2Process of fabrication of electronic devices and electronic device with a double encapsulation ringSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2015·Granted Oct 18, 2016·7 cites·18 claims
- 0585US10923638B2Electronic device comprising an optical chip and method of fabricationST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Feb 16, 2021·2 cites·7 claims
- 0675US11437527B2Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Sep 6, 2022·1 cites·17 claims
- 0770US11546059B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 0867US11664475B2Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting processST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted May 30, 2023·0 cites·19 claims
- 0967US11244910B2Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ringST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Feb 8, 2022·0 cites·10 claims
- 1066US10965376B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Mar 30, 2021·0 cites·16 claims
- 1165US10480994B2Electronic housing including a grooved coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Nov 19, 2019·1 cites·21 claims
- 1264US12288835B2Electronic device comprising an optical chip and method of fabricationST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 29, 2025·0 cites·4 claims
- 1364US11609402B2Electronic device comprising an optical chip and method of fabricationST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Mar 21, 2023·0 cites·19 claims
- 1464US10483181B2Electronic package and fabrication methodST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Nov 19, 2019·1 cites·21 claims
- 1562US2025079259A1Package for integrated circuit with heat dissipationST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1660US10672721B2Method for fabricating an electronic device and a stacked electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted Jun 2, 2020·0 cites·9 claims
- 1760US2022029034A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2021·Application pending·0 cites
- 1858US10833208B2Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Nov 10, 2020·0 cites·12 claims
- 1957US2024421176A1Optical package comprising a cap and a support substrate connected togetherST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 2056US2023411271A1Integrated circuit packagesST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 2155US11114312B2Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted Sep 7, 2021·0 cites·17 claims
- 2254US10177098B2Method for fabricating an electronic device and a stacked electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Jan 8, 2019·0 cites·13 claims
- 2353US2025374494A1Electromagnetic shielding cap for electronic circuitsST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 2453US2025374710A1Electromagnetic shielding cap for electronic circuitsST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 2552US11974419B1Method, systems, and apparatuses for electromagnetic shieldingST MICROELECTRONICS INT NV·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 2652US10483408B2Method for making a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Nov 19, 2019·0 cites·31 claims
- 2750US10325784B2Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Jun 18, 2019·0 cites·12 claims
- 2848US2019157469A1Encapsulation cover for an electronic package and fabrication processST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 2947US10748883B2Encapsulation cover for an electronic package and method of fabricationSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2018·Granted Aug 18, 2020·0 cites·5 claims
- 3047US9420685B2Electronic device comprising a substrate board equipped with a local reinforcing or balancing layerSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2014·Granted Aug 16, 2016·0 cites·21 claims
- 3147US2023402745A1Electronic device integrating an antenna and method of fabricating such a deviceST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 3245US10998470B2Cover for an electronic circuit packageST MICROELECTRONICS GRENOBLE 2·Filed 2018·Granted May 4, 2021·0 cites·17 claims
- 3345US9101077B2Electronic component package with a heat conductorST MICROELECTRONICS GRENOBLE 2·Filed 2012·Granted Aug 4, 2015·0 cites·20 claims
- 3443US2019189860A1Electronic circuit package coverST MICROELECTRONICS GRENOBLE 2·Filed 2018·Application pending·0 cites
- 3541US2019267349A1Method for manufacturing a plurality of electronic unitsST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 3640US2019280130A1Encapsulating cover for an electronic package and fabricating processST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 3735US2018190511A1Method for manufacturing a cover for an electronic package and electronic package comprising a coverST MICROELECTRONICS GRENOBLE 2·Filed 2017·Application pending·0 cites
- 3828US2017127567A1Electronic device equipped with a heat sinkSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →