Inventor · disambiguated record
Kai Hung Alex See
Also filed as: SEE KAI-HUNG ALEX
8 granted patents·3 pending applications·164 citations·filing 2005–2024
85Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD6UNITED MICROELECTRONICS CORP2CXMT CORP1TSENG YU-HSIANG1YE JIANHUI1
Top patents by PatentIndex Score
11 records- 0196US7527900B2Reticle and optical proximity correction methodUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 5, 2009·136 cites·16 claims
- 0291US10008387B1Embedded memory in back-end-of-line low-k dielectricGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Jun 26, 2018·8 cites·20 claims
- 0391US9997562B1Mram memory device and manufacturing method thereofGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Jun 12, 2018·9 cites·20 claims
- 0483US10468171B1Integrated circuits with magnetic tunnel junctions and methods of producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Nov 5, 2019·2 cites·17 claims
- 0578US10483121B2Embedded memory in back-end-of-line low-k dielectricGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Nov 19, 2019·2 cites·6 claims
- 0677US7553678B2Method for detecting semiconductor manufacturing conditionsUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 30, 2009·7 cites·18 claims
- 0760US2025393216A1Three-dimensional memory array and manufacturing method therefor, and electronic apparatusCXMT CORP·Filed 2024·Application pending·0 cites
- 0846US10784332B2Methods for producing integrated circuits with magnets and a wet etchant for the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Sep 22, 2020·0 cites·18 claims
- 0939US2007167110A1Multi-zone carrier head for chemical mechanical polishing and cmp method thereofTSENG YU-HSIANG·Filed 2006·Application pending·0 cites
- 1035US2007066047A1Method of forming opening and contactYE JIANHUI·Filed 2005·Application pending·0 cites
- 1134US10475495B2Integrated circuits with magnetic tunnel junctions and methods of producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Nov 12, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →