Inventor · disambiguated record
Katsuhiko Sekiya
Also filed as: SEKIYA KATSUHIKO
2 granted patents·1 pending application·14 citations·filing 2007–2010
56Inventor score
Top patents by PatentIndex Score
3 records- 0170US8662959B2Cutting method and cutting device for hard materialKURIYAMA KUNITAKA·Filed 2009·Granted Mar 4, 2014·11 cites·3 claims
- 0267US7929136B2Mist measuring apparatusHORKOS CORP·Filed 2007·Granted Apr 19, 2011·3 cites·6 claims
- 0333US2011097875A1Wafer processing methodDISCO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →