Inventor · disambiguated record
Kazuma Sekiya
Also filed as: SEKIYA KAZUMA
159 granted patents·57 pending applications·1,016 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
216 records- 0198US11858090B2Grinding apparatus and method of driving grinding apparatusDISCO CORP·Filed 2021·Granted Jan 2, 2024·2 cites·12 claims
- 0297US11276588B2Method of processing waferDISCO CORP·Filed 2020·Granted Mar 15, 2022·4 cites·5 claims
- 0397US6998571B2Laser beam processing machineDISCO CORP·Filed 2004·Granted Feb 14, 2006·137 cites·5 claims
- 0497US6465158B1Semiconductor wafer dividing methodDISCO CORP·Filed 2000·Granted Oct 15, 2002·149 cites·5 claims
- 0597US6344402B1Method of dicing workpieceDISCO CORP·Filed 2000·Granted Feb 5, 2002·149 cites·3 claims
- 0696US6803247B2Method for dividing semiconductor waferDISCO CORP·Filed 2003·Granted Oct 12, 2004·135 cites·5 claims
- 0794US10964571B2Conveyance systemDISCO CORP·Filed 2020·Granted Mar 30, 2021·3 cites·4 claims
- 0894US10668595B2Method of using laminated dressing boardDISCO CORP·Filed 2018·Granted Jun 2, 2020·5 cites·8 claims
- 0992US7559826B2Processing method and grinding apparatus of waferDISCO CORP·Filed 2006·Granted Jul 14, 2009·20 cites·5 claims
- 1090US8431428B2Optical device wafer processing method and laser processing apparatusSEKIYA KAZUMA·Filed 2011·Granted Apr 30, 2013·11 cites·2 claims
- 1189US12080564B2Package substrate processing methodDISCO CORP·Filed 2022·Granted Sep 3, 2024·1 cites·3 claims
- 1289US7348275B2Processing method for semiconductor waferDISCO CORP·Filed 2006·Granted Mar 25, 2008·15 cites·6 claims
- 1389US6102023APrecision cutting apparatus and cutting method using the sameDISCO CORP·Filed 1998·Granted Aug 15, 2000·72 cites·6 claims
- 1487US10312099B2Wafer processing methodDISCO CORP·Filed 2018·Granted Jun 4, 2019·4 cites·8 claims
- 1586US10532445B2Processing apparatus and processing method for workpieceDISCO CORP·Filed 2017·Granted Jan 14, 2020·4 cites·12 claims
- 1686US10113839B2Small unmanned air vehicle repulsing apparatusDISCO CORP·Filed 2016·Granted Oct 30, 2018·11 cites·1 claims
- 1785US10974359B2Automated workpiece conveying vehicleDISCO CORP·Filed 2019·Granted Apr 13, 2021·3 cites·4 claims
- 1885US9627260B2Workpiece cutting method using dummy wafer to determine condition of cutting bladeDISCO CORP·Filed 2016·Granted Apr 18, 2017·4 cites·3 claims
- 1985US7705430B2Semiconductor wafer and processing method for sameDISCO CORP·Filed 2006·Granted Apr 27, 2010·11 cites·1 claims
- 2084US10872791B2Tape attaching method and tape attaching apparatusDISCO CORP·Filed 2019·Granted Dec 22, 2020·3 cites·4 claims
- 2184US10403490B2Wafer processing methodDISCO CORP·Filed 2018·Granted Sep 3, 2019·3 cites·8 claims
- 2284US10332777B2Wafer processing methodDISCO CORP·Filed 2018·Granted Jun 25, 2019·3 cites·7 claims
- 2383US11059673B2Conveyance systemDISCO CORP·Filed 2020·Granted Jul 13, 2021·1 cites·4 claims
- 2483US7455568B2Water jet-processing machineDISCO CORP·Filed 2005·Granted Nov 25, 2008·11 cites·6 claims
- 2582US8021963B2Wafer treating methodDISCO CORP·Filed 2009·Granted Sep 20, 2011·7 cites·5 claims
- 2682US7629230B2Wafer processing methodDISCO CORP·Filed 2008·Granted Dec 8, 2009·8 cites·2 claims
- 2781US11222823B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jan 11, 2022·1 cites·17 claims
- 2881US10964572B2Conveyance systemDISCO CORP·Filed 2020·Granted Mar 30, 2021·1 cites·4 claims
- 2981US8802470B2Optical device processing methodDISCO CORP·Filed 2013·Granted Aug 12, 2014·3 cites·3 claims
- 3080US11072042B2Wafer and wafer producing methodDISCO CORP·Filed 2020·Granted Jul 27, 2021·1 cites·3 claims
- 3180US8802463B2Optical device processing methodDISCO CORP·Filed 2013·Granted Aug 12, 2014·5 cites·3 claims
- 3279US10974364B2Cutting blade mounting mechanismDISCO CORP·Filed 2018·Granted Apr 13, 2021·2 cites·3 claims
- 3379US10717605B2Conveyance systemDISCO CORP·Filed 2019·Granted Jul 21, 2020·2 cites·13 claims
- 3479US10576608B2Dressing board, cutting blade dressing method, and cutting apparatusDISCO CORP·Filed 2018·Granted Mar 3, 2020·2 cites·4 claims
- 3578US10847398B2Chuck table correction method and cutting apparatusDISCO CORP·Filed 2018·Granted Nov 24, 2020·2 cites·6 claims
- 3678US7675614B2Wafer inspecting method and deviceDISCO CORP·Filed 2008·Granted Mar 9, 2010·5 cites·5 claims
- 3778US7521337B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Apr 21, 2009·6 cites·2 claims
- 3878US7008305B2Water jet-processing machineDISCO CORP·Filed 2005·Granted Mar 7, 2006·7 cites·2 claims
- 3978US6361404B1Precision cutting apparatus and cutting method using the sameDISCO CORP·Filed 2000·Granted Mar 26, 2002·22 cites·10 claims
- 4077US6726526B2Cutting machineDISCO CORP·Filed 2002·Granted Apr 27, 2004·22 cites·4 claims
- 4176US10170379B2Wafer processing systemDISCO CORP·Filed 2016·Granted Jan 1, 2019·2 cites·8 claims
- 4276US7288467B2Wafer processing methodDISCO CORP·Filed 2005·Granted Oct 30, 2007·5 cites·5 claims
- 4376US6966826B2Grinding wheelDISCO CORP·Filed 2001·Granted Nov 22, 2005·18 cites·19 claims
- 4475US10358217B2Human transporting droneDISCO CORP·Filed 2016·Granted Jul 23, 2019·4 cites·4 claims
- 4575US8541287B2Laser processing method for waferSEKIYA KAZUMA·Filed 2012·Granted Sep 24, 2013·3 cites·4 claims
- 4675US7994025B2Wafer processing method without occurrence of damage to device areaDISCO CORP·Filed 2010·Granted Aug 9, 2011·3 cites·1 claims
- 4774US12374535B2Wafer processing apparatus and wafer processing methodDISCO CORP·Filed 2024·Granted Jul 29, 2025·0 cites·12 claims
- 4874US12134138B2Wafer manufacturing methodDISCO CORP·Filed 2023·Granted Nov 5, 2024·0 cites·4 claims
- 4974US9082712B2Device wafer processing methodDISCO CORP·Filed 2014·Granted Jul 14, 2015·3 cites·2 claims
- 5074US8016643B2Wafer grinding methodDISCO CORP·Filed 2007·Granted Sep 13, 2011·4 cites·5 claims
Showing the top 50 of 216 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →