Inventor · disambiguated record
Katsuya Takemura
Also filed as: TAKEMURA KATSUYA
81 granted patents·14 pending applications·854 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
95 records- 0195US6916591B2Photoacid generators, chemically amplified resist compositions, and patterning processSHINETSU CHEMICAL CO·Filed 2003·Granted Jul 12, 2005·79 cites·21 claims
- 0294US8846846B2Naphthalene derivative, resist bottom layer material, and patterning processKINSHO TAKESHI·Filed 2011·Granted Sep 30, 2014·8 cites·2 claims
- 0394US8835697B2Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning processKORI DAISUKE·Filed 2012·Granted Sep 16, 2014·9 cites·5 claims
- 0493US5691396APolysiloxane compounds and positive resist compositionsSHINETSU CHEMICAL CO·Filed 1996·Granted Nov 25, 1997·72 cites·20 claims
- 0591US10457779B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Oct 29, 2019·4 cites·18 claims
- 0689US10816900B2Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 27, 2020·3 cites·8 claims
- 0789US5847218ASulfonium salts and chemically amplified positive resist compositionsSHINETSU CHEMICAL CO·Filed 1997·Granted Dec 8, 1998·39 cites·19 claims
- 0888US5612170APositive resist compositionSHINETSU CHEMICAL CO·Filed 1995·Granted Mar 18, 1997·72 cites·23 claims
- 0987US9377689B2Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting filmSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 28, 2016·5 cites·15 claims
- 1087US7261995B2Nitrogen-containing organic compound, chemically amplified resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2005·Granted Aug 28, 2007·9 cites·4 claims
- 1186US6593056B2Chemically amplified positive resist composition and patterning methodSHINETSU CHEMICAL CO·Filed 2001·Granted Jul 15, 2003·26 cites·17 claims
- 1286US6511785B1Chemically amplified positive resist composition and patterning methodSHINETSU CHEMICAL CO·Filed 2000·Granted Jan 28, 2003·27 cites·17 claims
- 1386US5882844AChemically amplified positive resist compositionSHINETSU CHEMICAL CO·Filed 1997·Granted Mar 16, 1999·60 cites·17 claims
- 1486US5569784ASulfonium salt and resist compositionSHINETSU CHEMICAL CO·Filed 1995·Granted Oct 29, 1996·29 cites·24 claims
- 1585US9519217B2Chemically amplified positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2015·Granted Dec 13, 2016·3 cites·12 claims
- 1685US5880169ASulfonium salts and chemically amplified positive resist compositionsSHINETSU CHEMICAL CO·Filed 1996·Granted Mar 9, 1999·59 cites·16 claims
- 1784US8247166B2Double patterning processTAKEMURA KATSUYA·Filed 2009·Granted Aug 21, 2012·7 cites·8 claims
- 1884US6395446B1Resist compositions and patterning processSHINETSU CHEMICAL CO·Filed 2000·Granted May 28, 2002·24 cites·19 claims
- 1983US9091919B2Silicone structure-bearing polymer, resin composition, and photo-curable dry filmSHINETSU CHEMICAL CO·Filed 2013·Granted Jul 28, 2015·6 cites·4 claims
- 2083US8795955B2Naphthalene derivative, resist bottom layer material, resist bottom layer forming method, and patterning processKINSHO TAKESHI·Filed 2011·Granted Aug 5, 2014·3 cites·14 claims
- 2181US10216085B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 26, 2019·2 cites·8 claims
- 2281US5731126AChemically amplified positive resist compositionsSHINETSU CHEMICAL CO·Filed 1996·Granted Mar 24, 1998·48 cites·20 claims
- 2380US9045587B2Naphthalene derivative, resist bottom layer material, and patterning processSHINETSU CHEMICAL CO·Filed 2014·Granted Jun 2, 2015·2 cites·10 claims
- 2479US8835092B2Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivativeWATANABE TAKERU·Filed 2011·Granted Sep 16, 2014·3 cites·13 claims
- 2579US6635400B2Resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2001·Granted Oct 21, 2003·17 cites·23 claims
- 2676US10319653B2Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 11, 2019·3 cites·10 claims
- 2776US7745094B2Resist composition and patterning process using the sameSHINETSU CHEMICAL CO·Filed 2007·Granted Jun 29, 2010·4 cites·8 claims
- 2876US7741015B2Patterning process and resist compositionSHINETSU CHEMICAL CO·Filed 2008·Granted Jun 22, 2010·14 cites·14 claims
- 2976US5759739AResist composition with polymeric dissolution inhibitor and alkali soluble resinSHINETSU CHEMICAL CO·Filed 1996·Granted Jun 2, 1998·39 cites·7 claims
- 3075US8980525B2Chemically amplified positive resist composition and patterning processYASUDA HIROYUKI·Filed 2012·Granted Mar 17, 2015·8 cites·17 claims
- 3175US8129100B2Double patterning processTAKEMURA KATSUYA·Filed 2009·Granted Mar 6, 2012·4 cites·14 claims
- 3274US8968982B2Chemically amplified positive resist composition and patterning processYASUDA HIROYUKI·Filed 2012·Granted Mar 3, 2015·3 cites·6 claims
- 3372US9400428B2Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrateSHINETSU CHEMICAL CO·Filed 2014·Granted Jul 26, 2016·1 cites·21 claims
- 3472US5633409ATristertbutoxyphenyl sulfonium tosylate compoundSHINETSU CHEMICAL CO·Filed 1995·Granted May 27, 1997·10 cites·1 claims
- 3570US7344827B2Fine contact hole forming method employing thermal flow processSHINETSU CHEMICAL CO·Filed 2004·Granted Mar 18, 2008·10 cites·8 claims
- 3670US5691112ASulfonium salt and chemically amplified positive resist compositionSHINETSU CHEMICAL CO·Filed 1996·Granted Nov 25, 1997·9 cites·7 claims
- 3768US12197127B2Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2022·Granted Jan 14, 2025·0 cites·13 claims
- 3868US8968979B2Positive resist composition and patterning processTAKEMURA KATSUYA·Filed 2009·Granted Mar 3, 2015·2 cites·16 claims
- 3967US7638260B2Positive resist compositions and patterning processSHINETSU CHEMICAL CO·Filed 2007·Granted Dec 29, 2009·2 cites·5 claims
- 4067US7276324B2Nitrogen-containing organic compound, resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2004·Granted Oct 2, 2007·8 cites·12 claims
- 4167US5856561ABisphenol carboxylic acid tertiary ester derivatives and chemically amplified positive resist compositionsSHINETSU CHEMICAL CO·Filed 1996·Granted Jan 5, 1999·11 cites·14 claims
- 4265US11333975B2Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic componentIBM·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 4365US10919918B2Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic partsSHINETSU CHEMICAL CO·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 4465US8129099B2Double patterning processTAKEMURA KATSUYA·Filed 2009·Granted Mar 6, 2012·2 cites·16 claims
- 4564US7252925B2Nitrogen-containing organic compound, resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2004·Granted Aug 7, 2007·6 cites·6 claims
- 4663US8603732B2Resist underlayer film-forming composition, process for forming resist underlayer film and patterning processOGIHARA TSUTOMU·Filed 2010·Granted Dec 10, 2013·1 cites·34 claims
- 4763US2025147420A1Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic ComponentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 4862US2025068070A1Negative-type photosensitive resin composition, patterning method, method for forming cured film, interlayer insulative film, surface-protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 4961US9366961B2Silicone structure-bearing polymer, resin composition, and photo-curable dry filmSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 14, 2016·0 cites·13 claims
- 5061US6066433AHigh molecular weight silicone compounds, chemically amplified positive resist compositions, and patterning methodSHINETSU CHEMICAL CO·Filed 1998·Granted May 23, 2000·19 cites·17 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →