Inventor · disambiguated record
Kazumasa Takeuchi
Also filed as: TAKEUCHI KAZUMASA
19 granted patents·13 pending applications·230 citations·filing 1976–2023
94Inventor score
Files withHITACHI CHEMICAL CO LTD15TAKEUCHI KAZUMASA5RESONAC CORP3SHOWA DENKO MATERIALS CO LTD2TANAKA KENJI2
Top patents by PatentIndex Score
32 records- 0189US4270845ALaser apparatus for operationsMOCHIDA PHARM CO LTD·Filed 1976·Granted Jun 2, 1981·47 cites·20 claims
- 0287US6475629B1Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Nov 5, 2002·41 cites·9 claims
- 0384US11732124B2Compound and tabletHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 22, 2023·1 cites·15 claims
- 0481US7758951B2Prepreg, metal-clad laminate and printed circuit board using sameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jul 20, 2010·4 cites·12 claims
- 0580US9132611B2Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminateTAKEUCHI KAZUMASA·Filed 2010·Granted Sep 15, 2015·3 cites·7 claims
- 0676US7871694B2Prepreg, metal-clad laminate and printed circuit board using sameHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 18, 2011·2 cites·20 claims
- 0773US8196915B2Sheet returning unit for post processing apparatusHIRABAYASHI TAKESHI·Filed 2010·Granted Jun 12, 2012·3 cites·7 claims
- 0873US7138174B2Prepreg and a laminated sheetHITACHI CHEMICAL CO LTD·Filed 2003·Granted Nov 21, 2006·10 cites·27 claims
- 0973US6252010B1Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jun 26, 2001·39 cites·26 claims
- 1072US5532105APhotolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring boardHITACHI CHEMICAL CO LTD·Filed 1993·Granted Jul 2, 1996·39 cites·5 claims
- 1171US2025299877A1Device for manufacturing permanent magnetRESONAC CORP·Filed 2023·Application pending·0 cites
- 1269US7947332B2Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 24, 2011·2 cites·14 claims
- 1367US6156870AResin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring boardHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 5, 2000·22 cites·35 claims
- 1460US8664534B2Printed wiring boardTAKEUCHI KAZUMASA·Filed 2006·Granted Mar 4, 2014·2 cites·16 claims
- 1560US2012315438A1Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2012·Application pending·0 cites
- 1657US12053820B2Dust core compound, molded body, and dust coreSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·25 claims
- 1756US7648770B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jan 19, 2010·4 cites·11 claims
- 1853US2024209168A1Monomer composition, molded body, bonded magnet, dust coreRESONAC CORP·Filed 2021·Application pending·0 cites
- 1953US2024177897A1Magnetic powder, compound, molded body, bonded magnet, and powder magnetic coreRESONAC CORP·Filed 2022·Application pending·0 cites
- 2052US8433236B2Paper processing apparatus and image forming apparatusAZUMA TERUMITSU·Filed 2010·Granted Apr 30, 2013·1 cites·5 claims
- 2152US2012285732A1Multi-layer wiring boardTAKEUCHI KAZUMASA·Filed 2012·Application pending·0 cites
- 2248US8507100B2Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheetTANAKA KENJI·Filed 2010·Granted Aug 13, 2013·0 cites·12 claims
- 2348US2010065313A1Multi-layer wiring boardTAKEUCHI KAZUMASA·Filed 2006·Application pending·0 cites
- 2446US10251265B2Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Apr 2, 2019·0 cites·10 claims
- 2546US2023250257A1Compund for bonded magnets, molded body and bonded magnetSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2645US2020391287A1Compound powderHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 2743US2018237549A1Composite material, photosensitive resin composition for solder resist, and photosensitive elementHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 2842US2018237599A1Curable resin composition, composition for molding, resin molded article, and method for producing resin molded articleHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 2940US4696704AMaterial for lead framesNGK INSULATORS LTD·Filed 1986·Granted Sep 29, 1987·10 cites·16 claims
- 3039US2019062480A1Curable-resin composition and cured object thereofHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 3138US2011272185A1Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardKAWAGUCHI AKIKO·Filed 2010·Application pending·0 cites
- 3237US2012046154A1Sheet folding device, sheet processing device, image forming apparatus, and sheet folding methodTAKEUCHI KAZUMASA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →