Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

Abstract

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) with respect to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

1 . A prepreg formed by impregnating a fiber base material with a resin composition, wherein:
 the resin composition comprises an acrylic resin, and   the ratio of the peak height near 2240 cm −1  due to nitrile groups (P CN ) to the peak height near 1730 cm −1  due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.   
     
     
         2 . A prepreg according to  claim 1 , wherein the acrylic resin is an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight: 
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group and R 2  represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group. 
       
     
     
         3 . A prepreg according to  claim 2 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1). 
     
     
         4 . A prepreg according to  claim 2 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl. 
     
     
         5 . A prepreg formed by impregnating a fiber base material with a resin composition, wherein:
 the resin composition comprises an acrylic resin,   the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:   
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group and R 2  represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group. 
       
     
     
         6 . A prepreg according to  claim 5 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1). 
     
     
         7 . A prepreg according to  claim 6 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl. 
     
     
         8 . A prepreg according to  claim 5 , wherein the another monomer is selected from among acrylic acid esters, methacrylic acid esters, aromatic vinyl compounds and N-substituted maleimides. 
     
     
         9 . A prepreg according to  claim 1 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000. 
     
     
         10 . A prepreg according to  claim 2 , wherein the functional group-containing monomer is a monomer with at least one functional group selected from the group consisting of carboxyl, hydroxyl, acid anhydride, amino, amide and epoxy groups. 
     
     
         11 . A film with a resin, comprising a B-stage resin film formed using a resin composition, provided on a support film, wherein:
 the resin composition comprises an acrylic resin, and   the ratio of the peak height near 2240 cm −1  due to nitrile groups (P CN ) to the peak height near 1730 cm −1  due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.   
     
     
         12 . A film with a resin, comprising a B-stage resin film formed using a resin composition, provided on a support film, wherein:
 the resin composition comprises an acrylic resin,   the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:   
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group and R 2  represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group. 
       
     
     
         13 . A metal foil with a resin, comprising a resin layer formed using a resin composition, and a metal foil provided on at least one side of the resin layer, wherein:
 the resin composition comprises an acrylic resin, and   the ratio of the peak height near 2240 cm −1  due to nitrile groups (P CN ) to the peak height near 1730 cm −1  due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.   
     
     
         14 . A metal foil with a resin, comprising a resin layer formed using a resin composition, and a metal foil provided on at least one side of the resin layer, wherein:
 the resin composition comprises an acrylic resin,   the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of other monomer(s) that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:   
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group and R 2  represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group. 
       
     
     
         15 . A metal-clad laminate, comprising a substrate having a fiber base material embedded in a cured resin and a metal foil formed on at least one side of the substrate, wherein:
 the cured resin is formed by curing a resin composition comprising an acrylic resin, and   the ratio of the peak height near 2240 cm −1  due to nitrile groups (P CN ) to the peak height near 1730 cm −1  due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.   
     
     
         16 . A metal-clad laminate, comprising a substrate having a fiber base material embedded in a cured resin and a metal foil formed on at least one side of the substrate, wherein:
 the cured resin is formed by curing a resin composition comprising an acrylic resin,   the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:   
       
         
           
           
               
               
           
         
         wherein R 1  represents a hydrogen atom or a methyl group and R 2  represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group. 
       
     
     
         17 . A printed wiring board comprising at least a prepreg according to  claim 1 . 
     
     
         18 . A prepreg according to  claim 5 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000. 
     
     
         19 . A prepreg according to  claim 5 , wherein the functional group-containing monomer is a monomer with at least one functional group selected from the group consisting of carboxyl, hydroxyl, acid anhydride, amino, amide and epoxy groups. 
     
     
         20 . A printed wiring board comprising at least a prepreg according to  claim 5 . 
     
     
         21 . A printed wiring board comprising at least a film with a resin according to  claim 11 . 
     
     
         22 . A printed wiring board comprising at least a film with a resin according to  claim 12 . 
     
     
         23 . A printed wiring board comprising at least a metal foil with a resin according to  claim 13 . 
     
     
         24 . A printed wiring board comprising at least a metal foil with a resin according to  claim 14 . 
     
     
         25 . A printed wiring board comprising at least a metal-clad laminate according to  claim 15 . 
     
     
         26 . A printed wiring board comprising at least a metal-clad laminate according to  claim 16 .