Inventor · disambiguated record
Nozomu Takano
Also filed as: TAKANO NOZOMU
25 granted patents·14 pending applications·190 citations·filing 1991–2025
96Inventor score
Files withHITACHI CHEMICAL CO LTD24RESONAC CORP4SHOWA DENKO MATERIALS CO LTD3TAKEUCHI KAZUMASA3HITACHI CHEMICHAL CO LTD1
Top patents by PatentIndex Score
39 records- 0181US6696155B1Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 1996·Granted Feb 24, 2004·34 cites·59 claims
- 0281US6524717B1Prepreg, metal-clad laminate, and printed circuit board obtained from theseHITACHI CHEMICAL CO LTD·Filed 2000·Granted Feb 25, 2003·27 cites·25 claims
- 0377US6572968B2Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 3, 2003·11 cites·59 claims
- 0476US6667107B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2002·Granted Dec 23, 2003·18 cites·30 claims
- 0569US7947332B2Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 24, 2011·2 cites·14 claims
- 0668US7157506B2Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminateHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 2, 2007·7 cites·16 claims
- 0766US2010089626A1Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereofHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 0865US2024352287A1Curable adhesive composition, filmy adhesive, method for producing multilayered wiring board, and multilayered wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0960US9656353B2Reflow film, solder bump formation method, solder joint formation method, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2012·Granted May 23, 2017·1 cites·32 claims
- 1060US8664534B2Printed wiring boardTAKEUCHI KAZUMASA·Filed 2006·Granted Mar 4, 2014·2 cites·16 claims
- 1160US6329474B1Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazoleHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 11, 2001·10 cites·18 claims
- 1258US7166361B2Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 23, 2007·7 cites·12 claims
- 1357US2007207326A1Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnishMIZUNO YASUYUKI·Filed 2006·Application pending·0 cites
- 1456US6558797B1Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted May 6, 2003·16 cites·5 claims
- 1556US2025372368A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1654US7078106B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 18, 2006·1 cites·10 claims
- 1753US8440285B2Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereofTAKANO NOZOMU·Filed 2006·Granted May 14, 2013·0 cites·12 claims
- 1853US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 1953US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 2053US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 2152US6787614B2Thermosetting resin composition and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 7, 2004·2 cites·20 claims
- 2252US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 2352US2012285732A1Multi-layer wiring boardTAKEUCHI KAZUMASA·Filed 2012·Application pending·0 cites
- 2451US6462147B1Epoxy resin compositions for printed circuit board and printed circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Oct 8, 2002·10 cites·13 claims
- 2550US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 2649US7736749B2Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring boardHITACHI CHEMICHAL CO LTD·Filed 2006·Granted Jun 15, 2010·0 cites·40 claims
- 2749US6692792B2Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 2003·Granted Feb 17, 2004·0 cites·15 claims
- 2849US2023397337A1Method for manufacturing substrate with built-in components, and substrate with built-in componentsSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2948US6706409B2Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 16, 2004·3 cites·16 claims
- 3048US2010065313A1Multi-layer wiring boardTAKEUCHI KAZUMASA·Filed 2006·Application pending·0 cites
- 3147US2023328897A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming memberSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 3246US10251265B2Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Apr 2, 2019·0 cites·10 claims
- 3342US2005065275A1Thermosetting resin composition of low thermal expansibility and resin filmHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 3440US5304399AMethod of producing epoxy resin filmHITACHI CHEMICAL CO LTD·Filed 1993·Granted Apr 19, 1994·6 cites·9 claims
- 3538US6214468B1Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Apr 10, 2001·7 cites·11 claims
- 3638US2011272185A1Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardKAWAGUCHI AKIKO·Filed 2010·Application pending·0 cites
- 3737US5391687AMethod of producing high molecular weight epoxy resin using an amide solventHITACHI CHEMICAL CO LTD·Filed 1993·Granted Feb 21, 1995·3 cites·13 claims
- 3835US6180250B1Epoxy composition for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jan 30, 2001·5 cites·8 claims
- 3934US5225268AEpoxy resin film and method of producing epoxy resin filmHITACHI CHEMICAL CO LTD·Filed 1991·Granted Jul 6, 1993·3 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →