Inventor · disambiguated record
Kaori Takimoto
Also filed as: TAKIMOTO KAORI
23 granted patents·5 pending applications·41 citations·filing 2009–2024
93Inventor score
Top patents by PatentIndex Score
28 records- 0190US8760545B2Solid-state imaging device, manufacturing method therefor, solid-state imaging apparatus, and image capturing apparatusTAKIMOTO KAORI·Filed 2011·Granted Jun 24, 2014·10 cites·16 claims
- 0289US2024349526A1Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 0387US10840303B2Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Nov 17, 2020·1 cites·20 claims
- 0485US9281486B2Semiconductor device, method of manufacturing semiconductor device, solid-state imaging unit, and electronic apparatusSONY CORP·Filed 2012·Granted Mar 8, 2016·3 cites·14 claims
- 0584US9490441B2Semiconductor device, method of manufacturing semiconductor device, solid-state image pickup unit, and electronic apparatusSONY CORP·Filed 2013·Granted Nov 8, 2016·4 cites·20 claims
- 0684US7939860B2Solid-state imaging deviceSONY CORP·Filed 2009·Granted May 10, 2011·7 cites·7 claims
- 0783US12035549B2Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 0882US9219100B2Semiconductor device and solid-state image pickup unitSONY CORP·Filed 2014·Granted Dec 22, 2015·5 cites·13 claims
- 0980US7977140B2Methods for producing solid-state imaging device and electronic deviceSONY CORP·Filed 2009·Granted Jul 12, 2011·6 cites·10 claims
- 1078US10304904B2Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted May 28, 2019·1 cites·10 claims
- 1176US10014349B2Solid state image sensor, production method thereof and electronic deviceSONY CORP·Filed 2017·Granted Jul 3, 2018·1 cites·18 claims
- 1275US11282911B2Display device, display module, method of manufacturing display device, and method of manufacturing display moduleSONY GROUP CORP·Filed 2017·Granted Mar 22, 2022·1 cites·16 claims
- 1374US9666643B2Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2014·Granted May 30, 2017·1 cites·14 claims
- 1472US11489015B2Solid state image sensor, production method thereof and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 1570US9412791B2Solid state imaging element, production method thereof and electronic deviceSONY CORP·Filed 2015·Granted Aug 9, 2016·1 cites·12 claims
- 1663US12349482B2Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jul 1, 2025·0 cites·22 claims
- 1762US10804312B2Semiconductor device and electronic device having a chip size package (CSP)SONY CORP·Filed 2019·Granted Oct 13, 2020·0 cites·12 claims
- 1860US2022310680A1Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 1957US12237348B2Imaging device and ranging systemSONY GROUP CORP·Filed 2022·Granted Feb 25, 2025·0 cites·8 claims
- 2057US8247847B2Solid-state imaging device and manufacturing method thereforTAKIMOTO KAORI·Filed 2009·Granted Aug 21, 2012·0 cites·3 claims
- 2156US2013020663A1Solid-state imaging device and production method therefor, and electronic apparatusSONY CORP·Filed 2012·Application pending·0 cites
- 2255US8912579B2Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatusTAKIMOTO KAORI·Filed 2011·Granted Dec 16, 2014·0 cites·10 claims
- 2353US2016329379A1Solid state imaging element, production method thereof and electronic deviceSONY CORP·Filed 2016·Application pending·0 cites
- 2452US11454746B2Laminated lens structure and method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Sep 27, 2022·0 cites·21 claims
- 2552US10403669B2Semiconductor device and electronic device having a chip size package (CSP) stackSONY CORP·Filed 2016·Granted Sep 3, 2019·0 cites·14 claims
- 2648US9786708B2Unit pixel having an insulated contact penetrating a charge accumulation region, solid-state image pickup unit including the same, and method of manufacturing the unit pixelSONY CORP·Filed 2015·Granted Oct 10, 2017·0 cites·22 claims
- 2746US8384166B2Method for manufacturing semiconductor device and semiconductor deviceSONY CORP·Filed 2009·Granted Feb 26, 2013·0 cites·8 claims
- 2842US2020357838A1Laminated lens structure, solid-state imaging element, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →