Inventor · disambiguated record
Katsujiro Tanzawa
Also filed as: TANZAWA KATSUJIRO
11 granted patents·262 citations·filing 1989–2007
92Inventor score
Top patents by PatentIndex Score
11 records- 0190US4878957ADielectrically isolated semiconductor substrateTOSHIBA KK·Filed 1989·Granted Nov 7, 1989·90 cites·5 claims
- 0285US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0377US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 0474US7510945B2Element formation substrate, method of manufacturing the same, and semiconductor deviceTOSHIBA KK·Filed 2007·Granted Mar 31, 2009·5 cites·10 claims
- 0566US5332920ADielectrically isolated high and low voltage substrate regionsTOSHIBA KK·Filed 1992·Granted Jul 26, 1994·32 cites·26 claims
- 0664US7314766B2Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatusTOSHIBA KK·Filed 2003·Granted Jan 1, 2008·9 cites·23 claims
- 0763US5688702AProcess of making a semiconductor device using a silicon-on-insulator substrateTOSHIBA KK·Filed 1994·Granted Nov 18, 1997·28 cites·7 claims
- 0859US5097314ADielectrically isolated substrate with isolated high and low breakdown voltage elementsTOSHIBA KK·Filed 1991·Granted Mar 17, 1992·24 cites·6 claims
- 0959US5049968ADielectrically isolated substrate and semiconductor device using the sameTOSHIBA KK·Filed 1990·Granted Sep 17, 1991·24 cites·15 claims
- 1056US7285825B2Element formation substrate for forming semiconductor deviceTOSHIBA KK·Filed 2003·Granted Oct 23, 2007·6 cites·7 claims
- 1144US7531462B2Method of inspecting semiconductor waferTOSHIBA KK·Filed 2006·Granted May 12, 2009·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →