Inventor · disambiguated record
Kari Thorkelsson
Also filed as: THORKELSSON KARI
7 granted patents·9 pending applications·12 citations·filing 2010–2023
76Inventor score
Top patents by PatentIndex Score
16 records- 0195US10364505B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2016·Granted Jul 30, 2019·7 cites·20 claims
- 0287US11047059B2Dynamic modulation of cross flow manifold during elecroplatingLAM RES CORP·Filed 2019·Granted Jun 29, 2021·1 cites·15 claims
- 0386US10692735B2Electro-oxidative metal removal in through mask interconnect fabricationLAM RES CORP·Filed 2018·Granted Jun 23, 2020·4 cites·29 claims
- 0465US11610782B2Electro-oxidative metal removal in through mask interconnect fabricationLAM RES CORP·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
- 0559US2024279839A1Micro inert anode array for die level electrodeposition thickness distribution controlLAM RES CORP·Filed 2022·Application pending·0 cites
- 0657US2024084473A1Electrochemical assembly for forming semiconductor featuresLAM RES CORP·Filed 2022·Application pending·0 cites
- 0755US2025334884A1Water-based pretreatment for photoresist scum removalLAM RES CORP·Filed 2023·Application pending·0 cites
- 0849US12247310B2Lipseal edge exclusion engineering to maintain material integrity at wafer edgeLAM RES CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 0949US2023366119A1Preplating edge dryLAM RES CORP·Filed 2021·Application pending·0 cites
- 1048US12424453B2Low temperature direct copper-copper bondingLAM RES CORP·Filed 2019·Granted Sep 23, 2025·0 cites·25 claims
- 1148US2023230847A1Electro-oxidative metal removal accompanied by particle contamination mitigation in semiconductor processingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1247US2023340686A1Electrohydrodynamic ejection printing and electroplating for photoresist-free formation of metal featuresLAM RES CORP·Filed 2021·Application pending·0 cites
- 1345US8785123B2Direct hierarchical assembly of nanoparticlesXU TING·Filed 2010·Granted Jul 22, 2014·0 cites·20 claims
- 1445US2018251907A1Wide lipseal for electroplatingLAM RES CORP·Filed 2017·Application pending·0 cites
- 1544US2017342590A1Modulation of applied current during sealed rotational electroplatingLAM RES CORP·Filed 2017·Application pending·0 cites
- 1640US2019122890A1Multibath plating of a single metalLAM RES CORP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kari Thorkelsson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →