Inventor · disambiguated record
Kaichi Tsuruta
Also filed as: TSURUTA KAICHI
20 granted patents·5 pending applications·202 citations·filing 1992–2021
94Inventor score
Top patents by PatentIndex Score
25 records- 0196US5377425AVacuum drying apparatusNIKKU IND CO·Filed 1992·Granted Jan 3, 1995·80 cites·2 claims
- 0291US7793820B2Solder preform and a process for its manufactureSENJU METAL INDUSTRY CO·Filed 2008·Granted Sep 14, 2010·31 cites·19 claims
- 0389US10675719B2Joining member, solder material, solder paste, formed solder, flux coated material, and solder jointSENJU METAL INDUSTRY CO·Filed 2015·Granted Jun 9, 2020·3 cites·9 claims
- 0487US10265808B2Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solderSENJU METAL INDUSTRY CO·Filed 2015·Granted Apr 23, 2019·4 cites·4 claims
- 0586US8701973B2Solder bump formation on a circuit board using a transfer sheetKURAMOTO TAKEO·Filed 2010·Granted Apr 22, 2014·10 cites·5 claims
- 0684US10137538B2Liquid coating deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Nov 27, 2018·3 cites·13 claims
- 0784US7800230B2Solder preform and electronic componentDENSO CORP·Filed 2007·Granted Sep 21, 2010·12 cites·4 claims
- 0882US6919634B2Solder ball assembly, a method for its manufacture, and a method of forming solder bumpsSENJU METAL INDUSTRY CO·Filed 2003·Granted Jul 19, 2005·28 cites·19 claims
- 0975US10081852B2Solder preform and a process for its manufactureHIRANO NAOHIKO·Filed 2010·Granted Sep 25, 2018·2 cites·14 claims
- 1072US10722965B2Solder ball supplying method, solder ball supplying device, and solder bump forming methodSENJU METAL INDUSTRY CO·Filed 2013·Granted Jul 28, 2020·2 cites·9 claims
- 1171US10111342B2Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheetSENJU METAL INDUSTRY CO·Filed 2015·Granted Oct 23, 2018·2 cites·8 claims
- 1270US10780530B2Solder ball, solder joint, and joining methodSENJU METAL INDUSTRY CO·Filed 2019·Granted Sep 22, 2020·1 cites·8 claims
- 1368US10780531B2Solder ball, solder joint, and joining methodSENJU METAL INDUSTRY CO·Filed 2019·Granted Sep 22, 2020·1 cites·6 claims
- 1467US10391589B2Flux applying deviceSENJU METAL INDUSTRY CO·Filed 2015·Granted Aug 27, 2019·1 cites·4 claims
- 1562US7112888B2Solder ball assembly for bump formation and method for its manufactureSENJU METAL INDUSTRY CO·Filed 2003·Granted Sep 26, 2006·10 cites·17 claims
- 1660US10121606B2Method of manufacturing an electrode for an energy storage deviceSENJU METAL INDUSTRY CO·Filed 2016·Granted Nov 6, 2018·0 cites·4 claims
- 1754US11712760B2Layered bonding material, semiconductor package, and power moduleSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 1, 2023·0 cites·29 claims
- 1853US8961709B1Solder pasteTAKAURA KUNIHITO·Filed 2004·Granted Feb 24, 2015·9 cites·8 claims
- 1953US2023094946A1Metal Body, Fitting Connection Terminal, and Method for Forming Metal BodySENJU METAL INDUSTRY CO·Filed 2020·Application pending·0 cites
- 2051US2019358751A1Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 2148US9368249B2Method of manufacturing an electrode for an energy storage deviceNAKAMURA KATSUJI·Filed 2011·Granted Jun 14, 2016·0 cites·3 claims
- 2247US9821397B2Solder precoating method and workpiece for electronic equipmentKURAMOTO TAKEO·Filed 2004·Granted Nov 21, 2017·3 cites·17 claims
- 2345US2015000792A1Flux for Flux-cored Solder, and Flux-cored SolderSENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 2442US2016250719A1Solder transfer sheetSENJU METAL INDUSTRY CO·Filed 2014·Application pending·0 cites
- 2536US2017348805A1Solder alloy for plating and electronic componentSENJU METAL INDUSTRY CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →