Inventor · disambiguated record
Kai-Hsiang Wang
Also filed as: WANG KAI · WANG KAI-HSIANG
14 granted patents·6 pending applications·68 citations·filing 2012–2025
89Inventor score
Files withUNITED MICROELECTRONICS CORP8BSH HAUSGERAETE GMBH4SHANGHAI HUALI MICROELECT CORP4SHURCON MFG ZHEJIANG CO LTD2ANKO FOOD MACHINE CO LTD1
Top patents by PatentIndex Score
20 records- 0195US11545560B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·4 cites·9 claims
- 0291US8865482B2Method of detecting the circular uniformity of the semiconductor circular contact holesSHANGHAI HUALI MICROELECT CORP·Filed 2013·Granted Oct 21, 2014·37 cites·6 claims
- 0389US10943991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·4 cites·8 claims
- 0484US12300743B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·7 claims
- 0580US2025241038A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0678US12021134B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 25, 2024·0 cites·14 claims
- 0771USD1016865SRefrigeratorBSH HAUSGERAETE GMBH·Filed 2021·Granted Mar 5, 2024·5 cites·1 claims
- 0869USD794685SRefrigeratorBSH HAUSGERAETE GMBH·Filed 2015·Granted Aug 15, 2017·15 cites·1 claims
- 0963US12038223B2Metal member for household appliance and household applianceBSH HAUSGERAETE GMBH·Filed 2021·Granted Jul 16, 2024·0 cites·18 claims
- 1055US2023301312A1Even speed device and food forming apparatus thereofANKO FOOD MACHINE CO LTD·Filed 2022·Application pending·0 cites
- 1154US2024274715A1Semiconductor device having anisotropic layerUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1253US12116728B2Rotating pulp suction and robot transfer molding machine and molding methodSHURCON MFG ZHEJIANG CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·12 claims
- 1353US10700202B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 1451US12312748B2Pulp molded product line with roll forming functionSHURCON MFG ZHEJIANG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·19 claims
- 1543USD939266SFast thawing plateBSH HAUSGERAETE GMBH·Filed 2019·Granted Dec 28, 2021·3 cites·1 claims
- 1640US8658438B2Measurement of lateral diffusion of implanted ions in doped well region of semiconductor devicesSHANGHAI HUALI MICROELECT CORP·Filed 2012·Granted Feb 25, 2014·0 cites·8 claims
- 1738US11307151B2Method for detecting wafer backside defectSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2020·Granted Apr 19, 2022·0 cites·14 claims
- 1838US2013138239A1Semiconductor yield management systemSHANGHAI HUALI MICROELECT CORP·Filed 2012·Application pending·0 cites
- 1935US2013137196A1Method for monitoring devices in semiconductor processSHANGHAI HUALI MICROELECT CORP·Filed 2012·Application pending·0 cites
- 2034US2017294540A1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →