Inventor · disambiguated record
Kazuto Watanabe
Also filed as: WATANABE KAZUTO
19 granted patents·2 pending applications·200 citations·filing 2000–2022
93Inventor score
Top patents by PatentIndex Score
21 records- 0196US10217746B1Three-dimensional memory device having L-shaped word lines and a support structure and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Feb 26, 2019·32 cites·12 claims
- 0295US10790296B1Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layerSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Sep 29, 2020·19 cites·20 claims
- 0395US10181442B1Three-dimensional memory device having L-shaped word lines and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jan 15, 2019·23 cites·18 claims
- 0494US10797035B1Bonded assembly containing side bonding structures and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 6, 2020·16 cites·20 claims
- 0594US10211215B1Three-dimensional memory device containing word lines having vertical protrusion regions and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Feb 19, 2019·25 cites·14 claims
- 0693US6537461B1Process for treating solid surface and substrate surfaceHITACHI LTD·Filed 2000·Granted Mar 25, 2003·60 cites·9 claims
- 0784US12256544B2Three-dimensional memory device containing etch-stop structures and self-aligned insulating spacers and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Mar 18, 2025·1 cites·16 claims
- 0884US11569139B2Electrical overlay measurement methods and structures for wafer-to-wafer bondingWESTERN DIGITAL TECH INC·Filed 2021·Granted Jan 31, 2023·1 cites·3 claims
- 0975US7264677B2Process for treating solid surface and substrate surfaceRENESAS TECH CORP·Filed 2005·Granted Sep 4, 2007·3 cites·11 claims
- 1074US6613242B2Process for treating solid surface and substrate surfaceHITACHI LTD·Filed 2001·Granted Sep 2, 2003·12 cites·16 claims
- 1173US10309382B2Variable displacement swash plate compressorVALEO JAPAN CO LTD·Filed 2015·Granted Jun 4, 2019·2 cites·16 claims
- 1268US9099534B2Manufacturing method of semiconductor device, semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 4, 2015·2 cites·12 claims
- 1354US8786089B2Manufacturing method of semiconductor device, semiconductor device and electronic apparatusWATANABE KAZUTO·Filed 2012·Granted Jul 22, 2014·1 cites·8 claims
- 1452US11812598B2Memory device including laterally perforated support pillar structures surrounding contact via structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Nov 7, 2023·0 cites·14 claims
- 1552US11249398B2Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structuresJSR CORP·Filed 2019·Granted Feb 15, 2022·0 cites·10 claims
- 1651US6664184B2Method for manufacturing semiconductor device having an etching treatmentHITACHI LTD·Filed 2002·Granted Dec 16, 2003·3 cites·8 claims
- 1743US7025896B2Process for treating solid surface and substrate surfaceRENESAS TECH CORP·Filed 2003·Granted Apr 11, 2006·0 cites·26 claims
- 1842US9809489B2Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic deviceJSR CORP·Filed 2015·Granted Nov 7, 2017·0 cites·7 claims
- 1936US2010155382A1Method for Machining Valve Mechanism Component MemberVALEO THERMAL SYS JAPAN CO·Filed 2006·Application pending·0 cites
- 2034US2016057866A1Metal film forming method and conductive ink used in said methodJSR CORP·Filed 2014·Application pending·0 cites
- 2129US9543201B2Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnectionJSR CORP·Filed 2015·Granted Jan 10, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →