Inventor · disambiguated record
Kaori Watanabe
Also filed as: WATANABE KAORI
21 granted patents·2 pending applications·173 citations·filing 1995–2020
94Inventor score
Top patents by PatentIndex Score
23 records- 0185US6245650B1Process for production of semiconductor deviceNEC CORP·Filed 2000·Granted Jun 12, 2001·36 cites·22 claims
- 0284USD873131SPackaging containerG C DENTAL IND CORP·Filed 2018·Granted Jan 21, 2020·22 cites·1 claims
- 0382US10821221B2Encased syringeG C DENTAL IND CORP·Filed 2017·Granted Nov 3, 2020·7 cites·6 claims
- 0471US7871548B2Process for producing polymer oriented crystal, polymer oriented crystal produced by said production process, and method for determining critical elongation strain rate of polymer meltUNIV HIROSHIMA NAT UNIV CORP·Filed 2006·Granted Jan 18, 2011·4 cites·9 claims
- 0568US6444010B1Platinum group impurity recovery liquid and method for recovering platinum group impurityNEC CORP·Filed 2000·Granted Sep 3, 2002·12 cites·20 claims
- 0665US6432836B1Cleaning method for semiconductor substrate and cleaning solutionNEC CORP·Filed 1999·Granted Aug 13, 2002·29 cites·11 claims
- 0762US6164133AMethod and apparatus for pre-processing of semiconductor substrate surface analysisNEC CORP·Filed 1998·Granted Dec 26, 2000·26 cites·7 claims
- 0859US6468357B1Remover for a ruthenium containing metal and use thereofNEC CORP·Filed 2002·Granted Oct 22, 2002·5 cites·12 claims
- 0955US5549798AWet processing apparatus having individual reactivating feedback paths for anode and cathode waterNEC CORP·Filed 1995·Granted Aug 27, 1996·21 cites·78 claims
- 1053US6911096B2Method of collecting impurities on surface of semiconductor waferNEC ELECTRONICS CORP·Filed 2002·Granted Jun 28, 2005·4 cites·9 claims
- 1151US7442652B2Method for removing contamination and method for fabricating semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Oct 28, 2008·3 cites·16 claims
- 1250US12037180B2Packaging containerG C DENTAL IND CORP·Filed 2020·Granted Jul 16, 2024·0 cites·7 claims
- 1350US11583376B2Dental gypsum slurryG C DENTAL IND CORP·Filed 2018·Granted Feb 21, 2023·0 cites·6 claims
- 1448US6877518B2Chemical solution treatment apparatus for semiconductor substrateNEC ELECTRONICS CORP·Filed 2002·Granted Apr 12, 2005·2 cites·12 claims
- 1548US6551945B2Process for manufacturing a semiconductor deviceNEC CORP·Filed 2001·Granted Apr 22, 2003·2 cites·57 claims
- 1643US8735523B2Polymer crystalline materialsHIKOSAKA MASAMICHI·Filed 2008·Granted May 27, 2014·0 cites·16 claims
- 1743US7566663B2Method for manufacturing semiconductor device or semiconductor wafer using a chucking unitNEC ELECTRONICS CORP·Filed 2006·Granted Jul 28, 2009·0 cites·8 claims
- 1843US7351354B2Tungsten metal removing solution and method for removing tungsten metal by use thereofKANTO KAGAKU·Filed 2004·Granted Apr 1, 2008·0 cites·4 claims
- 1943US2019142705A1Method for kneading dental gypsum powderG C DENTAL IND CORP·Filed 2017·Application pending·0 cites
- 2039US2001023701A1Remover for a ruthenium containing metal and use thereofNEC CORP·Filed 2001·Application pending·0 cites
- 2135US8728616B2Polymer sheet and method for producing sameHIKOSAKA MASAMICHI·Filed 2010·Granted May 20, 2014·0 cites·11 claims
- 2233US9138933B2Process and apparatus for producing crystalline resin film or sheetWASHIYAMA JUNICHIRO·Filed 2010·Granted Sep 22, 2015·0 cites·5 claims
- 2331USD967713SPackaging containerG C DENTAL IND CORP·Filed 2019·Granted Oct 25, 2022·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →