Inventor · disambiguated record
Kai Wu
Also filed as: WU KAI · Wu kai-bin
3 granted patents·4 pending applications·9 citations·filing 2015–2024
58Inventor score
Files withAPPLIED MATERIALS INC4MEDIATEK INC2HEFEI INST OF PHYSICAL SCIENCES CHINESE ACADEMY OF SCIENCES1
Top patents by PatentIndex Score
7 records- 0191US9570399B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Feb 14, 2017·9 cites·18 claims
- 0277US2024229230A1Gas delivery for tungsten-containing layerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0372US11939668B2Gas delivery for tungsten-containing layerAPPLIED MATERIALS INC·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 0452US2025191791A1Method for controlling plasma edge fuel particle backflow by powder feedback injectionHEFEI INST OF PHYSICAL SCIENCES CHINESE ACADEMY OF SCIENCES·Filed 2024·Application pending·0 cites
- 0551US9947624B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2016·Granted Apr 17, 2018·0 cites·21 claims
- 0651US2023357929A1Apparatus and methods to promote wafer edge temperature uniformityAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0749US2023374660A1Hardware to uniformly distribute active species for semiconductor film processingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →