Inventor · disambiguated record
Kathy Wei Yan
Also filed as: YAN KATHY · YAN KATHY WEI
3 granted patents·42 pending applications·14 citations·filing 2006–2025
64Inventor score
Top patents by PatentIndex Score
45 records- 0180US7875503B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2006·Granted Jan 25, 2011·11 cites·20 claims
- 0280US2025316559A1Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025357268A1Semiconductor Device Package with Thermal ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US2024387321A1Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0576US2025357269A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025357301A1Semiconductor packages with reinforcement structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US2025343084A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875US2025351303A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US2025349795A1Metallic lid structure for dissipating heat generated by a thermal hot spot region of an ic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US2025357270A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1173US12362258B2Thermal module for a semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1273US2025349657A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1372US2025336768A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1472US2025343103A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1572US2025336769A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1672US2025336755A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1771US2025210420A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1871US2025246516A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1971US2025323122A1Package structure with heat dissipation structure having one or more vapor chambers over ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2070US2025239514A1Semiconductor packages with reinforcement structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2170US2025227884A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2269US8362627B2Reducing underfill keep out zone on substrate used in electronic device processingINTEL CORP·Filed 2010·Granted Jan 29, 2013·3 cites·11 claims
- 2369US2025233047A1Package structure with heat dissipation structure having one or more vapor chambers over ic chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2468US2025201668A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2568US2024395770A1Metallic lid structure for dissipating heat generated by a thermal hot spot region of an ic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2668US2025201652A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2768US2024395663A1Semiconductor Device Package with Thermal ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2868US2025201651A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2968US2025210458A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3067US2025218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3167US2025201658A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3259US2025246517A1Multi-zone impingement cooling of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3357US2025343096A1Semiconductor device packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3456US2025221310A1Adaptive liquid cooling system for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3556US2025372475A1Heat-Dissipating Lid ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3656US2025112137A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3756US2025096071A1Integrated circuit cooling systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3856US2025349663A1Heat spreader structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3956US2025351293A1Dynamic liquid cooling for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4055US2025309071A1Spacer frame for graphite thermal interface materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4155US2025167104A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4254US2025218986A1Method for forming device substrate, method for forming package structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4354US2024128148A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4452US2024145433A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD·Filed 2023·Application pending·0 cites
- 4551US2025132223A1Devices and methods for forming devices with lidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →