Inventor · disambiguated record
Katsuyuki Yonehara
Also filed as: YONEHARA KATSUYUKI
6 granted patents·2 pending applications·13 citations·filing 1991–2015
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0154US9255867B2Wire-pull test location identification on a wire of a microelectronic packageIBM·Filed 2013·Granted Feb 9, 2016·1 cites·20 claims
- 0254US8952551B2Semiconductor package and method for fabricating the sameHISADA TAKASHI·Filed 2012·Granted Feb 10, 2015·1 cites·11 claims
- 0348US2008237856A1Semiconductor Package and Method for Fabricating the SameIBM·Filed 2008·Application pending·0 cites
- 0441US9551640B2Wire-pull test location identification on a wire of a microelectronic packageIBM·Filed 2015·Granted Jan 24, 2017·0 cites·13 claims
- 0540US2009085155A1Method and apparatus for package-to-board impedance matching for high speed integrated circuitsBAILEY MARK J·Filed 2007·Application pending·0 cites
- 0631US5243141ATab tape, method of bonding tab tape and tab tape packageIBM·Filed 1991·Granted Sep 7, 1993·6 cites·22 claims
- 0730US5394675ATab tape, method of bonding tab tape and tab tape packageIBM·Filed 1993·Granted Mar 7, 1995·5 cites·2 claims
- 0827US8446735B2Semiconductor packageYONEHARA KATSUYUKI·Filed 2011·Granted May 21, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →