Inventor · disambiguated record
Kenji Amano
Also filed as: AMANO KENJI
13 granted patents·3 pending applications·255 citations·filing 1995–2024
92Inventor score
Files withRENESAS TECH CORP4DAIKIN IND LTD3TOKYO ELECTRON LTD3AMANO KENJI2HONDA GIKEN KOGYO KABUSHISHI K1
Top patents by PatentIndex Score
16 records- 0190US6331754B1Inductively-coupled-plasma-processing apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Dec 18, 2001·69 cites·33 claims
- 0288US6565662B2Vacuum processing apparatus for semiconductor processTOKYO ELECTRON LTD·Filed 2000·Granted May 20, 2003·60 cites·21 claims
- 0380US2025060119A1Air conditionerDAIKIN IND LTD·Filed 2024·Application pending·0 cites
- 0477US7429500B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 30, 2008·6 cites·10 claims
- 0575US7514293B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Apr 7, 2009·5 cites·5 claims
- 0675US6387208B2Inductive coupling plasma processing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted May 14, 2002·22 cites·12 claims
- 0768US6093087AWafer processing machine and a processing method therebySPEEDFAM CO LTD·Filed 1999·Granted Jul 25, 2000·35 cites·5 claims
- 0868US5713578AHydraulic sealing deviceHONDA GIKEN KOGYO KABUSHISHI K·Filed 1996·Granted Feb 3, 1998·35 cites·17 claims
- 0967US7348659B2Semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2004·Granted Mar 25, 2008·13 cites·2 claims
- 1067US2024117984A1Air conditioner, air-conditioning system, communication system, and device management systemDAIKIN IND LTD·Filed 2023·Application pending·0 cites
- 1165US8558362B2Semiconductor device and manufacturing method of the sameAMANO KENJI·Filed 2008·Granted Oct 15, 2013·3 cites·3 claims
- 1254US7948068B2Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portionRENESAS ELECTRONICS CORP·Filed 2009·Granted May 24, 2011·0 cites·4 claims
- 1350US7579674B2Semiconductor package configuration with improved lead portion arrangementRENESAS TECH CORP·Filed 2008·Granted Aug 25, 2009·0 cites·7 claims
- 1447US8102035B2Method of manufacturing a semiconductor deviceAMANO KENJI·Filed 2011·Granted Jan 24, 2012·0 cites·4 claims
- 1546US2021080141A1Air conditioner, air-conditioning system, communication system, control system, device control system, device management system, and sound information analysis systemDAIKIN IND LTD·Filed 2018·Application pending·0 cites
- 1634US5941534AHydraulic seal systemHONDA MOTOR CO LTD·Filed 1995·Granted Aug 24, 1999·7 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →