Inventor · disambiguated record
Kengo Aoya
Also filed as: AOYA KENGO
20 granted patents·18 pending applications·76 citations·filing 2008–2025
91Inventor score
Top patents by PatentIndex Score
38 records- 0193US8294261B2Protruding TSV tips for enhanced heat dissipation for IC devicesMAWATARI KAZUAKI·Filed 2010·Granted Oct 23, 2012·37 cites·19 claims
- 0290US8815648B1Multi-step sintering of metal paste for semiconductor device wire bondingTEXAS INSTRUMENTS INC·Filed 2013·Granted Aug 26, 2014·25 cites·14 claims
- 0386US11387179B2IC package with half-bridge power moduleTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
- 0475US2024379509A1Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0574US10879144B2Semiconductor package with multilayer moldTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 29, 2020·2 cites·17 claims
- 0673US2025087591A1Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0772US10580715B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 0872US2024213178A1Semiconductor device having tapered metal coated sidewallsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0969US12272626B2Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 8, 2025·0 cites·18 claims
- 1069US12125799B2Embedded die packaging with integrated ceramic substrateTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 22, 2024·0 cites·15 claims
- 1169US7882625B2Transfer mask in micro ball mounterTEXAS INSTR INCOPORATED·Filed 2008·Granted Feb 8, 2011·4 cites·14 claims
- 1268US8434664B2Micro-ball loading device and loading methodAOYA KENGO·Filed 2008·Granted May 7, 2013·5 cites·9 claims
- 1368US2025201677A1Conductive members atop semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1467US2023198422A1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1566US12046542B2Heat-dissipating wirebonded members on package surfacesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 23, 2024·0 cites·15 claims
- 1665US11601065B1Power converter moduleTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1764US11183441B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 1863US11923320B2Semiconductor device having tapered metal coated sidewallsTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 5, 2024·0 cites·17 claims
- 1958US12154861B2Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 26, 2024·0 cites·23 claims
- 2058US11942384B2Semiconductor package having an interdigitated mold arrangementTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·22 claims
- 2158US2025140626A1Sensor electronic deviceTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2258US2025112182A1Semiconductor package with an insulation layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2357US11848244B2Leaded wafer chip scale packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 19, 2023·0 cites·23 claims
- 2457US2025038009A1Stress relief sawn quad flat no-lead semiconductor packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2556US12040260B2Electronic package with surface contact wire extensionsTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 16, 2024·0 cites·17 claims
- 2656US11183460B2Embedded die packaging with integrated ceramic substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 23, 2021·0 cites·22 claims
- 2755US2024290676A1Shielded lead package for high voltage devicesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2855US2024258214A1Packaged electronic devices and methods of making sameTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2951US2024178164A1Sensor package with low aspect ratio through silicon viaTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3050US2015147845A1Dual sided embedded die and fabrication of same backgroundTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 3150US2022068556A1Transformers with separated magnetic membersTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 3247US11158595B2Embedded die package multichip moduleTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 26, 2021·0 cites·13 claims
- 3345US11410875B2Fan-out electronic deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 9, 2022·0 cites·14 claims
- 3443US2021125959A1Metal-covered chip scale packagesTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 3543US2010207273A1Micro Ball Feeding MethodAOYA KENGO·Filed 2008·Application pending·0 cites
- 3643US2016240392A1Dual sided embedded die and fabrication of same backgroundTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 3742US2015008566A1Method and structure of panelized packaging of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 3833US2013082383A1Electronic assembly having mixed interface including tsv dieAOYA KENGO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →