Inventor · disambiguated record
Kevin Bills
Also filed as: BILLS KEVIN · BILLS KEVIN J
8 granted patents·8 citations·filing 2009–2015
78Inventor score
Top patents by PatentIndex Score
8 records- 0182US8389870B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2010·Granted Mar 5, 2013·6 cites·2 claims
- 0255US8358509B2Reduced wiring requirements with signal slope manipulationIBM·Filed 2009·Granted Jan 22, 2013·2 cites·29 claims
- 0354US9548769B2Reduced wiring requirements with signal slope manipulationIBM·Filed 2014·Granted Jan 17, 2017·0 cites·29 claims
- 0452US9773725B2Coreless multi-layer circuit substrate with minimized pad capacitanceIBM·Filed 2015·Granted Sep 26, 2017·0 cites·10 claims
- 0551US8975525B2Corles multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Mar 10, 2015·0 cites·3 claims
- 0648US9060428B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Jun 16, 2015·0 cites·2 claims
- 0745US8743558B2Reduced wiring requirements with signal slope manipulationBILLS KEVIN J·Filed 2012·Granted Jun 3, 2014·0 cites·25 claims
- 0832US8593621B2Testing an optical fiber connectionBILLS KEVIN J·Filed 2010·Granted Nov 26, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →