Inventor · disambiguated record
Keunho Choi
Also filed as: CHOI KEUNHO
7 granted patents·1 pending application·13 citations·filing 2012–2023
77Inventor score
Top patents by PatentIndex Score
8 records- 0193US11315863B2Package substrate and method of manufacturing the package substrate, and semiconductor package including the package substrate and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 26, 2022·5 cites·20 claims
- 0291US11823995B2Package substrate, and semiconductor package including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0386US9034522B2Method of fabricating a patterned solid polymeric electrolyteKOREA ELECTRONICS TELECOMM·Filed 2012·Granted May 19, 2015·4 cites·12 claims
- 0485US9306240B2Solid polymeric electrolytes and lithium battery including the sameKOREA ELECTRONICS TELECOMM·Filed 2015·Granted Apr 5, 2016·2 cites·9 claims
- 0560US12453104B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 0655US2024312920A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0741US11626380B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0840US11824043B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →