Inventor · disambiguated record
Kevin Cooper
Also filed as: COOPER KEVIN · COOPER KEVIN E · COOPER KEVIN ELLIOT
9 granted patents·4 pending applications·60 citations·filing 2002–2016
87Inventor score
Top patents by PatentIndex Score
13 records- 0195US10786361B2In-situ formed intervertebral fusion device and methodDEPUY SYNTHES PRODUCTS INC·Filed 2016·Granted Sep 29, 2020·10 cites·10 claims
- 0286US7579279B2Method to passivate conductive surfaces during semiconductor processingFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 25, 2009·11 cites·16 claims
- 0379US7188630B2Method to passivate conductive surfaces during semiconductor processingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Mar 13, 2007·21 cites·13 claims
- 0476US7948607B2Immersion lithography apparatus and method of performing immersion lithographyFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 24, 2011·5 cites·20 claims
- 0565US8752228B2Apparatus for cleaning of circuit substratesFARKAS JANOS·Filed 2005·Granted Jun 17, 2014·3 cites·14 claims
- 0657US7387970B2Method of using an aqueous solution and composition thereofFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jun 17, 2008·6 cites·6 claims
- 0751US7456105B1CMP metal polishing slurry and process with reduced solids concentrationAMD INC·Filed 2002·Granted Nov 25, 2008·4 cites·12 claims
- 0849US2004230309A1In-situ formed intervertebral fusion device and methodDEPUY SPINE INC·Filed 2004·Application pending·0 cites
- 0945US8097535B2Fabrication of self-assembled nanowire-type interconnects on a semiconductor deviceCOOPER KEVIN·Filed 2007·Granted Jan 17, 2012·0 cites·12 claims
- 1043US7837762B2Method of distancing a bubble and bubble displacement apparatusFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Nov 23, 2010·0 cites·13 claims
- 1141US2012133031A1Fabrication of self-assembled nanowire-type interconnects on a semiconductor deviceCOOPER KEVIN·Filed 2011·Application pending·0 cites
- 1240US2009134496A1Wafer and method of forming alignment markersFREESCALE SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 1338US2006223320A1Polishing technique to minimize abrasive removal of material and composition thereforCOOPER KEVIN E·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →