Inventor · disambiguated record
Keisuke Fukuda
Also filed as: FUKUDA KEISUKE
14 granted patents·3 pending applications·112 citations·filing 2000–2016
91Inventor score
Files withFUJITSU LTD6RENESAS ELECTRONICS CORP4TASHIRO KAZUHIRO2FUJITSU MICROELECTRONICS LTD1FUJITSU SEMICONDUCTOR LTD1
Top patents by PatentIndex Score
17 records- 0181US6319129B1Method and a video game system of generating a field mapKONAMI CORP·Filed 2000·Granted Nov 20, 2001·55 cites·15 claims
- 0279US8268670B2Method of semiconductor device protectionTASHIRO KAZUHIRO·Filed 2011·Granted Sep 18, 2012·4 cites·2 claims
- 0376US9510417B2LED drive method and LED drive deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·14 claims
- 0468US6673654B2Method of manufacturing semiconductor device using heated conveyance memberFUJITSU LTD·Filed 2002·Granted Jan 6, 2004·15 cites·3 claims
- 0566US7807481B2Method of semiconductor device protection, package of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Oct 5, 2010·2 cites·3 claims
- 0666US7518388B2Contactor for electronic components and test method using the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Apr 14, 2009·4 cites·13 claims
- 0763US7309996B2Contactor for electronic components and test method using the sameFUJITSU LTD·Filed 2004·Granted Dec 18, 2007·9 cites·3 claims
- 0861US7382046B2Semiconductor device protection cover, and semiconductor device unit including the coverFUJITSU LTD·Filed 2004·Granted Jun 3, 2008·7 cites·16 claims
- 0957US6806723B2Contactor having contact electrodes formed by laser processingFUJITSU LTD·Filed 2003·Granted Oct 19, 2004·8 cites·28 claims
- 1055US7598336B2Two-part curing high-durable polyurethane elastomer compositionNIHON GOSEI KAKO CO LTD·Filed 2004·Granted Oct 6, 2009·6 cites·4 claims
- 1154US10104732B2LED drive method and LED drive deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 16, 2018·0 cites·12 claims
- 1249US8164181B2Semiconductor device packaging structureTASHIRO KAZUHIRO·Filed 2010·Granted Apr 24, 2012·0 cites·2 claims
- 1347US9831890B2Semiconductor device, power supply device and control method for semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 28, 2017·0 cites·13 claims
- 1441US2008034580A1Suspension-terminal connecting apparatus and method of manufacturing suspension assemblyFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1540US9872353B2LED lighting device and LED illuminating deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jan 16, 2018·0 cites·8 claims
- 1635US2003073264A1Method of manufacturing semiconductor device from semiconductor wafer having thick peripheral portionFUJITSU LTD·Filed 2002·Application pending·0 cites
- 1730US2016198973A1Electrophysiological Assessment of LearningUNIV VANDERBILT·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →