Inventor · disambiguated record
Kenji Fukuzono
Also filed as: FUKUZONO KENJI
26 granted patents·22 pending applications·103 citations·filing 2002–2021
95Inventor score
Top patents by PatentIndex Score
48 records- 0188US9362202B2Electronic device and method for manufacturing sameFUJITSU LTD·Filed 2014·Granted Jun 7, 2016·9 cites·20 claims
- 0288US8089146B2Semiconductor device and heat radiation memberFUKUZONO KENJI·Filed 2010·Granted Jan 3, 2012·12 cites·7 claims
- 0387US8004096B2Semiconductor device and a manufacturing method thereofFUJITSU LTD·Filed 2006·Granted Aug 23, 2011·16 cites·14 claims
- 0481US8933558B2Semiconductor package, wiring board unit, and electronic apparatusWATANABE MANABU·Filed 2012·Granted Jan 13, 2015·6 cites·10 claims
- 0580US8023268B2Printed circuit board unit and semiconductor packageFUJITSU LTD·Filed 2009·Granted Sep 20, 2011·9 cites·4 claims
- 0679US7260806B2Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding programFUJITSU LTD·Filed 2005·Granted Aug 21, 2007·8 cites·17 claims
- 0778US8152953B2Method of making printed wiring board and method of making printed circuit board unitYOSHIMURA HIDEAKI·Filed 2009·Granted Apr 10, 2012·8 cites·6 claims
- 0873US8642896B2Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit boardFUKUZONO KENJI·Filed 2010·Granted Feb 4, 2014·4 cites·7 claims
- 0968US10418310B2BGA package substrate and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Sep 17, 2019·1 cites·7 claims
- 1068US10261249B2Optical module and method of manufacturing optical moduleFUJITSU LTD·Filed 2017·Granted Apr 16, 2019·1 cites·7 claims
- 1166US7268002B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2005·Granted Sep 11, 2007·3 cites·9 claims
- 1265US7053493B2Semiconductor device having stiffenerFUJITSU LTD·Filed 2004·Granted May 30, 2006·10 cites·5 claims
- 1362US9006876B2Semiconductor apparatus and manufacturing method thereofFUJITSU LTD·Filed 2014·Granted Apr 14, 2015·1 cites·16 claims
- 1461US7222316B2Board design aiding apparatus, board design aiding method and board design aiding programFUJITSU LTD·Filed 2004·Granted May 22, 2007·8 cites·15 claims
- 1558US7943001B2Process for producing multilayer boardFUJITSU LTD·Filed 2007·Granted May 17, 2011·1 cites·4 claims
- 1655US8866270B2Method of manufacturing semiconductor device mounting structureFUJITSU LTD·Filed 2014·Granted Oct 21, 2014·0 cites·1 claims
- 1754US10586770B2Optical moduleFUJITSU LTD·Filed 2018·Granted Mar 10, 2020·0 cites·10 claims
- 1854US10444450B2Optical moduleFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·0 cites·9 claims
- 1954US8716839B2Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2013·Granted May 6, 2014·0 cites·6 claims
- 2052US7787257B2Printed wiring board unitFUJITSU LTD·Filed 2009·Granted Aug 31, 2010·0 cites·9 claims
- 2151US8168471B2Semiconductor device and manufacturing method of a semiconductor deviceKANDA TAKASHI·Filed 2010·Granted May 1, 2012·0 cites·6 claims
- 2251US8119923B2Circuit boardYOSHIMURA HIDEAKI·Filed 2008·Granted Feb 21, 2012·0 cites·4 claims
- 2351US2006168803A1Layered board and manufacturing method of the same, electronic apparatus having the layered boardFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2451US2006147684A1Layered board and manufacturing method of the same, electronic apparatus having the layered boardFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2551US2007012477A1Electronic component package including joint material having higher heat conductivityFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2651US2007222039A1Semiconductor device and manufacturing method of a semiconductor deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2750US2009294160A1Method of making printed wiring board and electrically-conductive binderFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2849US7291901B2Packaging method, packaging structure and package substrate for electronic partsFUJITSU LTD·Filed 2004·Granted Nov 6, 2007·3 cites·9 claims
- 2948US2021375771A1Electronic deviceFUJITSU LTD·Filed 2021·Application pending·0 cites
- 3047US6869822B2Method of making a semiconductor device with adhesive sealing subjected to two-fold hardeningFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·3 cites·13 claims
- 3147US2007200209A1Semiconductor device and heat radiation memberFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3246US9515005B2Package mounting structureFUJITSU LTD·Filed 2014·Granted Dec 6, 2016·0 cites·6 claims
- 3345US10181437B2Package substrate and method of manufacturing package substrateFUJITSU LTD·Filed 2018·Granted Jan 15, 2019·0 cites·4 claims
- 3445US2005266212A1Layered board and manufacturing method of the same, electronic apparatus having the layered boardFUJITSU LTD·Filed 2004·Application pending·0 cites
- 3545US2005266213A1Layered board and manufacturing method of the same, electronic apparatus having the layered boardFUJITSU LTD·Filed 2004·Application pending·0 cites
- 3643US2014190669A1Cooling head and electronic apparatusFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3743US2013314877A1Semiconductor package and wiring board unitFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3843US2014209285A1Method for manufacturing cooling device, cooling device and electronic component package equipped with cooling deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3942US2008006915A1Semiconductor package, method of production of same, printed circuit board, and electronic apparatusFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4042US2007228530A1Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreaderFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4141US2013021769A1Multichip module, printed wiring board, method for manufacturing multichip module, and method for manufacturing printed wiring boardFUJITSU LTD·Filed 2012·Application pending·0 cites
- 4240US2005110169A1Semiconductor device and method of making the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 4338US2018217343A1Optical moduleFUJITSU LTD·Filed 2018·Application pending·0 cites
- 4438US2013083504A1Electronic deviceFUKUZONO KENJI·Filed 2012·Application pending·0 cites
- 4536US2015359141A1Liquid-cooled jacket and electronic deviceFUJITSU LTD·Filed 2015·Application pending·0 cites
- 4636US2011100690A1Electrically conductive body and printed wiring board and method of making the sameFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4734US2008002374A1Substrate with stiffener and manufacturing method thereofFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4833US2015264810A1Circuit board and manufacturing method of circuit boardFUJITSU LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →