Inventor · disambiguated record
Kenji Furuta
Also filed as: FURUTA KENJI
50 granted patents·31 pending applications·507 citations·filing 1975–2022
98Inventor score
Top patents by PatentIndex Score
81 records- 0196US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 0295US10815396B2Thermally conductive pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Granted Oct 27, 2020·9 cites·18 claims
- 0391US9683138B2Pressure-sensitive adhesive sheet and magnetic disk driveNITTO DENKO CORP·Filed 2016·Granted Jun 20, 2017·4 cites·20 claims
- 0488US4093882ACoreless motorOLYMPUS OPTICAL CO·Filed 1975·Granted Jun 6, 1978·42 cites·9 claims
- 0587US7080712B2Soundproof material for vehicle and method of manufacturing the materialKASAI KOGYO KK·Filed 2002·Granted Jul 25, 2006·59 cites·16 claims
- 0686US9093519B2Wafer processing methodDISCO CORP·Filed 2014·Granted Jul 28, 2015·7 cites·6 claims
- 0786US3934267AVital phenomenon recording and/or reproducing deviceKOSAKA SHINYA·Filed 1975·Granted Jan 20, 1976·36 cites·15 claims
- 0884US11168236B2Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Granted Nov 9, 2021·2 cites·15 claims
- 0984US9025279B2Pressure-sensitive adhesive sheet and magnetic disk driveNITTO DENKO CORP·Filed 2014·Granted May 5, 2015·9 cites·8 claims
- 1083US8597812B2Thermally conductive member and battery pack device using sameTERADA YOSHIO·Filed 2010·Granted Dec 3, 2013·5 cites·6 claims
- 1183US8581144B2Laser processing apparatus and laser processing methodFURUTA KENJI·Filed 2009·Granted Nov 12, 2013·8 cites·4 claims
- 1282US10525668B2Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2017·Granted Jan 7, 2020·1 cites·26 claims
- 1382US9018080B2Wafer processing methodDISCO CORP·Filed 2013·Granted Apr 28, 2015·5 cites·3 claims
- 1481US6055500AInformation transfer, recording and reproducing deviceOLYMPUS OPTICAL CO·Filed 1996·Granted Apr 25, 2000·43 cites·22 claims
- 1580US10864598B2Evaluation jig and evaluation method for height position detection unit of laser processing apparatusDISCO CORP·Filed 2018·Granted Dec 15, 2020·1 cites·6 claims
- 1680US5510924AVoice information transfer system capable of easily performing voice information transfer using optical signalOLYMPUS OPTICAL CO·Filed 1995·Granted Apr 23, 1996·76 cites·6 claims
- 1779US8865334B2Thermally conductive member, and battery device using the sameTERADA YOSHIO·Filed 2013·Granted Oct 21, 2014·3 cites·5 claims
- 1873US7482554B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jan 27, 2009·4 cites·4 claims
- 1970US7396780B2Method for laser processing of waferDISCO CORP·Filed 2005·Granted Jul 8, 2008·4 cites·1 claims
- 2069US2021079270A1Sheet body, electronic part case, method for testing moisture permeation of sheet body, method for measuring moisture permeability and moisture permeation testing device for sheet bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2169US2020399510A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2267US7883992B2Wafer dividing methodDISCO CORP·Filed 2008·Granted Feb 8, 2011·2 cites·2 claims
- 2366US10410901B2Electrostatic chuck table using methodDISCO CORP·Filed 2018·Granted Sep 10, 2019·1 cites·5 claims
- 2465US7776721B2Laser processing method for gallium arsenide waferDISCO CORP·Filed 2007·Granted Aug 17, 2010·1 cites·4 claims
- 2565US2018066163A1Magnetic disc drive, helium gas filled container, and apparatusNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2663US6621771B1Disk drive with an objective lens disposed in an optical head moving along a transfer line not intersecting the center of rotation of a diskALPS ELECTRIC CO LTD·Filed 2000·Granted Sep 16, 2003·5 cites·5 claims
- 2762US11434341B2Resin sheet and adhesive-layer-having resin sheetNITTO DENKO CORP·Filed 2018·Granted Sep 6, 2022·0 cites·7 claims
- 2862US8685839B2Workpiece dividing methodFURUTA KENJI·Filed 2011·Granted Apr 1, 2014·1 cites·2 claims
- 2962US2024291109A1Separator for nonaqueous electrolyte secondary battery and nonaqueous electrolyte secondary batteryNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 3062US2024291108A1Multilayer body for battery, and method for producing multilayer body for batteryNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 3162US2022193830A1Laser processing apparatusDISCO CORP·Filed 2021·Application pending·0 cites
- 3261US10647891B2Pressure-sensitive adhesive sheet and magnetic disc deviceNITTO DENKO CORP·Filed 2019·Granted May 12, 2020·0 cites·19 claims
- 3357US12062575B2Wafer processing methodDISCO CORP·Filed 2021·Granted Aug 13, 2024·0 cites·9 claims
- 3457US10593353B2Pressure-sensitive adhesive sheet and magnetic disc deviceNITTO DENKO CORP·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 3554US12074067B2Wafer dividing method and dividing apparatusDISCO CORP·Filed 2022·Granted Aug 27, 2024·0 cites·6 claims
- 3654US4413290ATape recorder with a voice signal responsive circuitOLYMPUS OPTICAL CO·Filed 1982·Granted Nov 1, 1983·12 cites·7 claims
- 3753US2015299531A1Pressure-sensitive adhesive material and thermally conductive pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3853US2019284447A1Pressure-Sensitive Adhesive Sheet and Use ThereofNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 3952US7927974B2Method of forming a modified layer in a substrateDISCO CORP·Filed 2008·Granted Apr 19, 2011·0 cites·2 claims
- 4051US11149171B2Thermally-conductive pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2014·Granted Oct 19, 2021·0 cites·17 claims
- 4151US6892555B2Knitting fabric having novel set up structure and method of knitting itSHIMA SEIKI MFG·Filed 2002·Granted May 17, 2005·4 cites·4 claims
- 4251US2019127610A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 4350US4435735AMagnetic recording-reproducing apparatus with constant length cue signalOLYMPUS OPTICAL CO·Filed 1982·Granted Mar 6, 1984·6 cites·4 claims
- 4450US2014004342A1Flame-retardant thermally-conductive pressure-sensitive adhesive sheetTOJO MIDORI·Filed 2012·Application pending·0 cites
- 4549US2008003708A1Method of processing sapphire substrateHOSHINO HITOSHI·Filed 2007·Application pending·0 cites
- 4648US2021193521A1Device chip manufacturing methodDISCO CORP·Filed 2020·Application pending·0 cites
- 4747US11195757B2Wafer processing methodDISCO CORP·Filed 2020·Granted Dec 7, 2021·0 cites·7 claims
- 4847US2006255022A1Wafer laser processing method and laser beam processing machineHOSHINO HITOSHI·Filed 2006·Application pending·0 cites
- 4947US2019071589A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 5047US2019077999A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2017·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →