Inventor · disambiguated record
Kevin J. Hess
Also filed as: HESS KEVIN · HESS KEVIN J · HESS KEVIN JAMES
39 granted patents·3 pending applications·498 citations·filing 2002–2023
98Inventor score
Top patents by PatentIndex Score
42 records- 0197US7355289B2Packaged integrated circuit with enhanced thermal dissipationFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 8, 2008·59 cites·15 claims
- 0295US7632715B2Method of packaging semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 15, 2009·44 cites·18 claims
- 0393US9446858B2Apparatus and methods for tethered aerial platform and systemHESS KEVIN·Filed 2015·Granted Sep 20, 2016·39 cites·18 claims
- 0493US7572680B2Packaged integrated circuit with enhanced thermal dissipationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 11, 2009·24 cites·20 claims
- 0592US9076664B2Stacked semiconductor die with continuous conductive viasPELLEY PERRY H·Filed 2011·Granted Jul 7, 2015·16 cites·17 claims
- 0692US8349666B1Fused buss for plating features on a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Jan 8, 2013·15 cites·11 claims
- 0792US7374971B2Semiconductor die edge reconditioningFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 20, 2008·28 cites·10 claims
- 0892US7129566B2Scribe street structure for backend interconnect semiconductor wafer integrationFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Oct 31, 2006·72 cites·10 claims
- 0991US7276435B1Die level metal density gradient for improved flip chip package reliabilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 2, 2007·27 cites·20 claims
- 1089US7626276B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 1, 2009·17 cites·19 claims
- 1183US7247552B2Integrated circuit having structural support for a flip-chip interconnect pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 24, 2007·12 cites·20 claims
- 1282US7821104B2Package device having crack arrest feature and method of formingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 26, 2010·10 cites·19 claims
- 1381US6933614B2Integrated circuit die having a copper contact and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·31 cites·15 claims
- 1480US11874826B1Corrective notification to account for delay or error in updating digital rules applied to produce resourcesAVALARA INC·Filed 2020·Granted Jan 16, 2024·2 cites·18 claims
- 1580US7829997B2Interconnect for chip level power distributionFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 9, 2010·9 cites·20 claims
- 1679US7750465B2Packaged integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 6, 2010·9 cites·15 claims
- 1777US7550318B2Interconnect for improved die to substrate electrical couplingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 23, 2009·7 cites·20 claims
- 1876US6921979B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jul 26, 2005·27 cites·33 claims
- 1974US8501539B2Semiconductor device packageHESS KEVIN J·Filed 2009·Granted Aug 6, 2013·6 cites·20 claims
- 2073US7241636B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 10, 2007·5 cites·20 claims
- 2172US8680674B2Methods and structures for reducing heat exposure of thermally sensitive semiconductor devicesMCSHANE MICHAEL B·Filed 2012·Granted Mar 25, 2014·3 cites·20 claims
- 2270US8368172B1Fused buss for plating features on a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 5, 2013·2 cites·20 claims
- 2370US8105933B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2007·Granted Jan 31, 2012·4 cites·10 claims
- 2468US8129226B2Power lead-on-chip ball grid array packageJOHNSTON JAMES P·Filed 2007·Granted Mar 6, 2012·6 cites·17 claims
- 2567US9099475B2Techniques for reducing inductance in through-die vias of an electronic assemblyMCSHANE MICHAEL B·Filed 2012·Granted Aug 4, 2015·2 cites·19 claims
- 2667US9082757B2Stacked semiconductor devicesPELLEY PERRY H·Filed 2013·Granted Jul 14, 2015·2 cites·13 claims
- 2766US12197428B1Corrective notification to account for delay or error in updating digital rules applied to produce resourcesAVALARA INC·Filed 2023·Granted Jan 14, 2025·0 cites·18 claims
- 2865US8318549B2Molded semiconductor package having a filler materialHESS KEVIN J·Filed 2009·Granted Nov 27, 2012·3 cites·19 claims
- 2965US7656045B2Cap layer for an aluminum copper bond padFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 2, 2010·3 cites·18 claims
- 3064US8791582B2Integrated circuit package with voltage distributorLEE CHU-CHUNG·Filed 2010·Granted Jul 29, 2014·3 cites·17 claims
- 3163US8796822B2Stacked semiconductor devicesPELLEY PERRY H·Filed 2011·Granted Aug 5, 2014·1 cites·16 claims
- 3263US7857137B2Wound care kitJ & J CONSUMER COMPANIES INC·Filed 2009·Granted Dec 28, 2010·7 cites·9 claims
- 3361US9093429B2Methods and structures for reducing heat exposure of thermally sensitive semiconductor devicesMCSHANE MICHAEL B·Filed 2012·Granted Jul 28, 2015·1 cites·17 claims
- 3458US8912667B2Packaged integrated circuit using wire bondsWENZEL ROBERT J·Filed 2012·Granted Dec 16, 2014·1 cites·18 claims
- 3557US8274146B2High frequency interconnect pad structureSTOCKINGER MICHAEL A·Filed 2008·Granted Sep 25, 2012·1 cites·10 claims
- 3655US2020032085A1Modified Epoxy Resin Compositions for Additive ManufacturingTRI/REX LLC·Filed 2019·Application pending·0 cites
- 3753US9331046B2Integrated circuit package with voltage distributorFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 3, 2016·0 cites·20 claims
- 3850US9331050B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2012·Granted May 3, 2016·0 cites·18 claims
- 3949US2020248017A1Voltage Variable and Electrical Overstress Protection Materials for 3D Printing or Additive ManufacturingTRI/REX LLC·Filed 2020·Application pending·0 cites
- 4047US11315433B2Systems and methods for providing a terrain and runway alerting service over a secured data linkHONEYWELL INT INC·Filed 2019·Granted Apr 26, 2022·0 cites·20 claims
- 4142US10435151B2System for converting a safeguarded free flight onboard battery-powered drone to a ground-powered tethered droneHESS KEVIN·Filed 2017·Granted Oct 8, 2019·0 cites·16 claims
- 4237US2006022353A1Probe pad arrangement for an integrated circuit and method of formingAJURIA SERGIO A·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →