Inventor · disambiguated record
Kenichi Hidaka
Also filed as: HIDAKA KENICHI
25 granted patents·4 pending applications·200 citations·filing 2000–2022
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD8NGK INSULATORS LTD7NEC ELECTRONICS CORP4ONUMA TAKUJI2RENESAS ELECTRONICS CORP2
Top patents by PatentIndex Score
29 records- 0195US6653697B2High frequency switch circuit and communications terminal using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 25, 2003·80 cites·7 claims
- 0292US7106121B2High frequency switch circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 12, 2006·46 cites·5 claims
- 0386US10421213B2Ceramic formed body extrusion method, ceramic formed body, and ceramic porous bodyNGK INSULATORS LTD·Filed 2017·Granted Sep 24, 2019·2 cites·6 claims
- 0481US7337547B2High frequency switching circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Mar 4, 2008·12 cites·10 claims
- 0577US8592942B2Non-volatile semiconductor memory deviceKODAMA NORIAKI·Filed 2009·Granted Nov 26, 2013·5 cites·23 claims
- 0676US9289754B2Honeycomb structureNGK INSULATORS LTD·Filed 2014·Granted Mar 22, 2016·2 cites·14 claims
- 0774US8519508B2Semiconductor device having an anti-fuse element and a transistor with a pocket regionKUBOTA YOSHITAKA·Filed 2010·Granted Aug 27, 2013·4 cites·5 claims
- 0873US10632648B2Ceramic formed body extrusion method, ceramic formed body, and ceramic porous bodyNGK INSULATORS LTD·Filed 2019·Granted Apr 28, 2020·0 cites·2 claims
- 0973US10596722B2Ceramic formed body extrusion method, ceramic formed body, and ceramic porous bodyNGK INSULATORS LTD·Filed 2019·Granted Mar 24, 2020·0 cites·10 claims
- 1072US9339799B2Honeycomb structure and manufacturing method thereofNGK INSULATORS LTD·Filed 2014·Granted May 17, 2016·2 cites·18 claims
- 1170US7020453B2High-frequency switch circuit and mobile telecommunications terminal device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 28, 2006·12 cites·20 claims
- 1268US7250642B2Field-effect transistorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 31, 2007·4 cites·11 claims
- 1366US12390793B2Porous composite and method of producing porous compositeNGK INSULATORS LTD·Filed 2022·Granted Aug 19, 2025·0 cites·10 claims
- 1466US8982648B2Semiconductor memory device and antifuse programming methodONUMA TAKUJI·Filed 2011·Granted Mar 17, 2015·4 cites·15 claims
- 1564US9105338B2OTP memoryHIDAKA KENICHI·Filed 2012·Granted Aug 11, 2015·2 cites·8 claims
- 1664US8530949B2Semiconductor device with common contact coupling gate wiring integrated with gate electrode of antifuse to diffusion layerONUMA TAKUJI·Filed 2011·Granted Sep 10, 2013·2 cites·10 claims
- 1762US7838961B2Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Nov 23, 2010·2 cites·22 claims
- 1861US8942023B2Semiconductor deviceTSUDA HIROSHI·Filed 2012·Granted Jan 27, 2015·1 cites·14 claims
- 1960US11666890B2Porous ceramic structureNGK INSULATORS LTD·Filed 2020·Granted Jun 6, 2023·0 cites·7 claims
- 2059US7626855B2Semiconductor memory deviceNEC ELECTRONICS CORP·Filed 2007·Granted Dec 1, 2009·4 cites·14 claims
- 2157US7449393B2Method of manufacturing a semiconductor device with a shallow trench isolation structureNEC ELECTRONICS CORP·Filed 2005·Granted Nov 11, 2008·1 cites·21 claims
- 2255US8675385B2Semiconductor device having memory unit, method of writing to or reading from memory unit, and semiconductor device manufacturing methodTAKAOKA HIROMICHI·Filed 2011·Granted Mar 18, 2014·1 cites·26 claims
- 2355US7425747B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 16, 2008·6 cites·10 claims
- 2455US7079860B1Semiconductor apparatus and communication apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jul 18, 2006·8 cites·15 claims
- 2552US9349739B2OTP memoryRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·0 cites·2 claims
- 2645US2011122672A1Non-volatile semiconductor memory deviceRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2744US2009003081A1Non-volatile memory and method of manufacturing sameNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2837US2006261880A1Charge pump type booster circuit and antenna switchMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2937US2007085592A1High-frequency switch circuit, semiconductor device and communication terminal apparatusYASUDA EIJI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →