Inventor · disambiguated record
Kevin Kunzhong Hu
Also filed as: HU KEVIN KUNZHONG
12 granted patents·2 pending applications·121 citations·filing 2011–2016
90Inventor score
Top patents by PatentIndex Score
14 records- 0197US9431371B2Semiconductor package with a bridge interposerBROADCOM CORP·Filed 2015·Granted Aug 30, 2016·20 cites·21 claims
- 0295US9059179B2Semiconductor package with a bridge interposerKARIKALAN SAMPATH K V·Filed 2011·Granted Jun 16, 2015·27 cites·20 claims
- 0395US8928128B2Semiconductor package with integrated electromagnetic shieldingKARIKALAN SAMPATH K V·Filed 2012·Granted Jan 6, 2015·37 cites·20 claims
- 0487US8872321B2Semiconductor packages with integrated heat spreadersZHAO SAM ZIQUN·Filed 2012·Granted Oct 28, 2014·9 cites·20 claims
- 0584US8749072B2Semiconductor package with integrated selectively conductive film interposerZHAO SAM ZIQUN·Filed 2012·Granted Jun 10, 2014·7 cites·20 claims
- 0683US9548251B2Semiconductor interposer having a cavity for intra-interposer dieKHAN REZAUR RAHMAN·Filed 2012·Granted Jan 17, 2017·7 cites·28 claims
- 0783US9013041B2Semiconductor package with ultra-thin interposer without through-semiconductor viasKARIKALAN SAMPATH K V·Filed 2011·Granted Apr 21, 2015·7 cites·18 claims
- 0873US8791533B2Semiconductor package having an interposer configured for magnetic signalingCHEN XIANGDONG·Filed 2012·Granted Jul 29, 2014·3 cites·20 claims
- 0972US9275976B2System-in-package with integrated socketZHAO SAM ZIQUN·Filed 2012·Granted Mar 1, 2016·3 cites·20 claims
- 1062US9153507B2Semiconductor package with improved testabilityZHAO SAM ZIQUN·Filed 2012·Granted Oct 6, 2015·1 cites·20 claims
- 1158US9293393B2Stacked packaging using reconstituted wafersBROADCOM CORP·Filed 2014·Granted Mar 22, 2016·0 cites·20 claims
- 1251US2016155728A1Stacked packaging using reconstituted wafersBROADCOM CORP·Filed 2016·Application pending·0 cites
- 1348US2013154106A1Stacked Packaging Using Reconstituted WafersHU KEVIN KUNZHONG·Filed 2011·Application pending·0 cites
- 1443US9041171B2Programmable interposer with conductive particlesZHAO SAM ZIQUN·Filed 2011·Granted May 26, 2015·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →