Inventor · disambiguated record
Kenji Iida
Also filed as: IIDA KENJI
55 granted patents·30 pending applications·408 citations·filing 1987–2024
98Inventor score
Top patents by PatentIndex Score
85 records- 0193US9077019B2Electricity storage device and vehicleKOSAKI AKIHIRO·Filed 2011·Granted Jul 7, 2015·34 cites·7 claims
- 0291US9627721B2Electricity storage device and vehicleKOSAKI AKIHIRO·Filed 2011·Granted Apr 18, 2017·29 cites·6 claims
- 0389US8110749B2Printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 7, 2012·20 cites·4 claims
- 0487USD461733SFluid pressure cylinderSMC KK·Filed 2001·Granted Aug 20, 2002·35 cites·1 claims
- 0584US7388157B2Printed wiring boardFUJITSU LTD·Filed 2005·Granted Jun 17, 2008·13 cites·10 claims
- 0681US9483029B2Timepiece and electronic timepieceSEIKO EPSON CORP·Filed 2015·Granted Nov 1, 2016·3 cites·5 claims
- 0777US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 0876US8151456B2Method of producing substrateMAEHARA YASUTOMO·Filed 2008·Granted Apr 10, 2012·9 cites·5 claims
- 0976US6476580B1Electronic apparatus and control method for electronic apparatusSEIKO EPSON CORP·Filed 2000·Granted Nov 5, 2002·19 cites·52 claims
- 1075US8754333B2Printed circuit board incorporating fibersYOSHIMURA HIDEAKI·Filed 2011·Granted Jun 17, 2014·4 cites·7 claims
- 1175US7152314B2Method of manufacturing circuit boardFUJITSU LTD·Filed 2004·Granted Dec 26, 2006·21 cites·15 claims
- 1275US2024428672A1Notification apparatus, notification method, notification system, and computer-readable recording mediumNEC CORP·Filed 2024·Application pending·0 cites
- 1373US8530550B2Crosslinkable rubber compositionSANNOMIYA AKIRA·Filed 2011·Granted Sep 10, 2013·4 cites·18 claims
- 1473US8072725B2Connection unit and vehicle incorporating the sameKOSAKI AKIHIRO·Filed 2009·Granted Dec 6, 2011·9 cites·8 claims
- 1571US12118867B2Notification apparatus, notification method, notification system, and computer readable recording mediumNEC CORP·Filed 2022·Granted Oct 15, 2024·0 cites·12 claims
- 1670US10518683B2Vehicle seatTOYOTA BOSHOKU KK·Filed 2018·Granted Dec 31, 2019·3 cites·6 claims
- 1770US8178791B2Wiring substrate including conductive core substrate, and manufacturing method thereofABE TOMOYUKI·Filed 2008·Granted May 15, 2012·4 cites·20 claims
- 1870US6630852B2Power-generation detection circuit for use in an electronic device and power-generation detection method and power consumption control method for use in connection therewithSEIKO EPSON CORP·Filed 2001·Granted Oct 7, 2003·13 cites·2 claims
- 1969US9252410B2Power storage apparatusKOSAKI AKIHIRO·Filed 2010·Granted Feb 2, 2016·1 cites·6 claims
- 2069US6343537B1Dual stroke cylinderSMC CORP·Filed 2000·Granted Feb 5, 2002·12 cites·7 claims
- 2168US11215309B2Heating device and method of heating a heated object using the sameNICHIAS CORP·Filed 2015·Granted Jan 4, 2022·2 cites·12 claims
- 2266US9380649B2Jacket heater and method for attaching sameIIDA KENJI·Filed 2011·Granted Jun 28, 2016·2 cites·16 claims
- 2365US8035037B2Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·2 cites·10 claims
- 2464US10680424B2Overhead wire damperFURUKAWA ELECTRIC POWER SYSTEMS CO LTD·Filed 2018·Granted Jun 9, 2020·2 cites·2 claims
- 2564US9769936B2Production method of circuit boardFUJITSU LTD·Filed 2014·Granted Sep 19, 2017·1 cites·4 claims
- 2663US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 2763US8119925B2Core substrate and printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 21, 2012·2 cites·7 claims
- 2862US6620083B2Tool pot for tool magazineTOYODA MACHINE WORKS LTD·Filed 2001·Granted Sep 16, 2003·12 cites·10 claims
- 2961US6452358B1Electronic apparatus and control method for electronic apparatusSEIKO EPSON CORP·Filed 2000·Granted Sep 17, 2002·7 cites·29 claims
- 3059US11380180B2Notification apparatus, notification method, notification system, and computer-readable recording mediumNEC CORP·Filed 2019·Granted Jul 5, 2022·0 cites·9 claims
- 3159US2009098391A1Core member and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3258US10667331B2Heating tapeNICHIAS CORP·Filed 2014·Granted May 26, 2020·0 cites·7 claims
- 3358US8802984B2Junction block, and vehicleKOSAKI AKIHIRO·Filed 2010·Granted Aug 12, 2014·2 cites·7 claims
- 3458US7943001B2Process for producing multilayer boardFUJITSU LTD·Filed 2007·Granted May 17, 2011·1 cites·4 claims
- 3558US6476579B1Pulse motor driving device, pulse motor driving method, timepiece device, and timepiece device control methodSEIKO EPSON CORP·Filed 1999·Granted Nov 5, 2002·22 cites·71 claims
- 3657US5415920APatterned chromium barrier layer with flange-like structureFUJITSU LTD·Filed 1993·Granted May 16, 1995·22 cites·5 claims
- 3757US2008299402A1Polyimide film, polyimide metal laminate and process for producing the sameMITSUI CHEMICALS INC·Filed 2007·Application pending·0 cites
- 3857US2009318068A1Ventilating apparatus for vehicleTOYOTA BOSHOKU KK·Filed 2008·Application pending·0 cites
- 3956USD369610SAir cylinderSMC CORP·Filed 1994·Granted May 7, 1996·7 cites·1 claims
- 4056US2008268761A1Condition monitoring apparatus for vehicle passenger compartmentTOYOTA BOSHOKU KK·Filed 2008·Application pending·0 cites
- 4156US2025311057A1Cover body including heat-generating element and thermocoupleNICHIAS CORP·Filed 2023·Application pending·0 cites
- 4255US7935891B2Wiring board manufacturing methodFUJITSU LTD·Filed 2008·Granted May 3, 2011·0 cites·1 claims
- 4355US6701613B2Multilayer circuit board and method of manufacturing the sameFUJITSU LTD·Filed 2001·Granted Mar 9, 2004·5 cites·8 claims
- 4454US5669283ACylinder apparatusSMC KK·Filed 1996·Granted Sep 23, 1997·10 cites·26 claims
- 4553US10602570B2Heating jacketNICHIAS CORP·Filed 2014·Granted Mar 24, 2020·0 cites·8 claims
- 4653US6389686B2Process for fabricating a thin multi-layer circuit boardFUJITSU LTD·Filed 2000·Granted May 21, 2002·4 cites·14 claims
- 4753US2009280339A1Polyimide film, polyimide metal laminate using same, and method for manufacturing sameMITSUI CHEMICALS INC·Filed 2006·Application pending·0 cites
- 4851US8119923B2Circuit boardYOSHIMURA HIDEAKI·Filed 2008·Granted Feb 21, 2012·0 cites·4 claims
- 4951US2010018758A1Printed wiring boardFUJITSU LTD·Filed 2009·Application pending·0 cites
- 5051US2010018762A1Buildup printed circuit boardFUJITSU LTD·Filed 2009·Application pending·0 cites
Showing the top 50 of 85 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kenji Iida files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →