Inventor · disambiguated record
Kentaro Iizuka
Also filed as: IIZUKA KENTARO
20 granted patents·5 pending applications·57 citations·filing 2005–2023
91Inventor score
Top patents by PatentIndex Score
25 records- 0186US7329564B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Feb 12, 2008·12 cites·4 claims
- 0284US10840116B2Wafer producing apparatusDISCO CORP·Filed 2019·Granted Nov 17, 2020·4 cites·3 claims
- 0384US7863160B2Wafer processing method including forming blocking and dividing groovesDISCO CORP·Filed 2009·Granted Jan 4, 2011·11 cites·4 claims
- 0483US7649157B2Chuck table for use in a laser beam processing machineDISCO CORP·Filed 2005·Granted Jan 19, 2010·8 cites·3 claims
- 0578US9381577B2Chuck tableDISCO CORP·Filed 2013·Granted Jul 5, 2016·7 cites·4 claims
- 0677US9266315B2Separating apparatusDISCO CORP·Filed 2013·Granted Feb 23, 2016·4 cites·2 claims
- 0777US7772092B2Wafer processing methodDISCO CORP·Filed 2008·Granted Aug 10, 2010·6 cites·2 claims
- 0876US10916460B2Wafer producing apparatusDISCO CORP·Filed 2018·Granted Feb 9, 2021·2 cites·9 claims
- 0966US12479053B2Holding table assembly and processing methodDISCO CORP·Filed 2022·Granted Nov 25, 2025·0 cites·2 claims
- 1065US7602071B2Apparatus for dividing an adhesive film mounted on a waferDISCO CORP·Filed 2005·Granted Oct 13, 2009·3 cites·4 claims
- 1161US2022250192A1Laser processing apparatusDISCO CORP·Filed 2022·Application pending·0 cites
- 1256US12479048B2Wafer processing apparatusDISCO CORP·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1356US11328945B2Wafer forming apparatusDISCO CORP·Filed 2021·Granted May 10, 2022·0 cites·2 claims
- 1454US12046710B2Lithium ion secondary batteryJTEKT CORP·Filed 2019·Granted Jul 23, 2024·0 cites·4 claims
- 1554US2022410320A1Marking machine and wafer production systemDISCO CORP·Filed 2022·Application pending·0 cites
- 1651US11521877B2Carrier trayDISCO CORP·Filed 2021·Granted Dec 6, 2022·0 cites·2 claims
- 1751US11355359B2Workpiece processing methodDISCO CORP·Filed 2020·Granted Jun 7, 2022·0 cites·2 claims
- 1850US11501927B2Alkali metal ion capacitorJTEKT CORP·Filed 2019·Granted Nov 15, 2022·0 cites·6 claims
- 1945US10981250B2Wafer producing apparatusDISCO CORP·Filed 2018·Granted Apr 20, 2021·0 cites·7 claims
- 2045US2005205540A1Laser beam processing machineDISCO CORP·Filed 2005·Application pending·0 cites
- 2142US7799700B2Method for applying resin film to face of semiconductor waferDISCO CORP·Filed 2006·Granted Sep 21, 2010·0 cites·4 claims
- 2241US2006084239A1Wafer dividing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 2340US10910241B2Wafer producing apparatus and carrying trayDISCO CORP·Filed 2018·Granted Feb 2, 2021·0 cites·7 claims
- 2440US2006180136A1Tape expansion apparatusDISCO CORP·Filed 2005·Application pending·0 cites
- 2539US10799987B2Laser processing apparatusDISCO CORP·Filed 2018·Granted Oct 13, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →