Inventor · disambiguated record
Kengo Inoue
Also filed as: INOUE KENGO
11 granted patents·12 pending applications·113 citations·filing 2003–2024
89Inventor score
Files withNIDEC CORP7FUJITSU LTD6FUJITSU SEMICONDUCTOR LTD4FUJI ELECTRIC CO LTD2FUJITSU MICROELECTRONICS LTD1
Top patents by PatentIndex Score
23 records- 0195US8778814B2Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Jul 15, 2014·20 cites·7 claims
- 0289US7626234B2Semiconductor device with shallow trench isolation and its manufacture methodFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Dec 1, 2009·13 cites·9 claims
- 0389US6949830B2Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor deviceFUJITSU LTD·Filed 2003·Granted Sep 27, 2005·45 cites·11 claims
- 0484US7485570B2Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor deviceFUJITSU LTD·Filed 2005·Granted Feb 3, 2009·8 cites·4 claims
- 0581US8349722B2Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jan 8, 2013·6 cites·6 claims
- 0672US7183200B2Method for fabricating a semiconductor deviceFUJITSU LTD·Filed 2005·Granted Feb 27, 2007·6 cites·10 claims
- 0763US7037803B2Manufacture of semiconductor device having STI and semiconductor device manufacturedFUJITSU LTD·Filed 2003·Granted May 2, 2006·12 cites·33 claims
- 0860US2024404939A1Semiconductor device and vehicleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 0959US2025105069A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1055US8352219B2Numerical structure-analysis calculation systemUNIV KEIO·Filed 2008·Granted Jan 8, 2013·1 cites·15 claims
- 1155US2024314978A1Cooling deviceNIDEC CORP·Filed 2023·Application pending·0 cites
- 1253US2025218896A1Heat dissipation member, cooling device, and semiconductor moduleNIDEC CORP·Filed 2023·Application pending·0 cites
- 1353US2023324133A1Liquid cooling jacket and cooling deviceNIDEC CORP·Filed 2023·Application pending·0 cites
- 1453US2023324129A1Cooling deviceNIDEC CORP·Filed 2023·Application pending·0 cites
- 1553US2023298967A1Liquid cooling jacket and cooling deviceNIDEC CORP·Filed 2023·Application pending·0 cites
- 1653US2023324132A1Cooling deviceNIDEC CORP·Filed 2023·Application pending·0 cites
- 1753US2023204305A1Heat dissipation member and cooling deviceNIDEC CORP·Filed 2022·Application pending·0 cites
- 1852US9349600B2Semiconductor device manufacturing method and semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted May 24, 2016·0 cites·8 claims
- 1949US7211480B2Semiconductor device with shallow trench isolation and its manufacture methodFUJITSU LTD·Filed 2004·Granted May 1, 2007·2 cites·15 claims
- 2044US2012252227A1Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor deviceOWADA TAMOTSU·Filed 2012·Application pending·0 cites
- 2144US2016240543A1Semiconductor device manufacturing method and semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2016·Application pending·0 cites
- 2241US2006205193A1Method for forming SiC-based film and method for fabricating semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2337US10814886B2System of optimizing activation degree of occupant of vehicleTOYOTA BOSHOKU KK·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →