Inventor · disambiguated record
Keonsoo Jang
Also filed as: JANG KEONSOO
5 granted patents·3 pending applications·4 citations·filing 2009–2021
70Inventor score
Top patents by PatentIndex Score
8 records- 0166US8420722B2Composition and methods of forming solder bump and flip chip using the sameEOM YONG SUNG·Filed 2009·Granted Apr 16, 2013·3 cites·10 claims
- 0264US9462736B2Composition and methods of forming solder bump and flip chip using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Oct 4, 2016·1 cites·8 claims
- 0361US2021358885A1Laser bonding method and a semiconductor package including a bonding part and a bonding targetELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 0457US11107790B2Laser bonding methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Aug 31, 2021·0 cites·15 claims
- 0555US9155236B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Oct 6, 2015·0 cites·4 claims
- 0652US8802760B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Aug 12, 2014·0 cites·5 claims
- 0741US2019287870A1Filling composition for semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Application pending·0 cites
- 0841US2019211231A1Adhesive film for electric device and method of fabricating semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Keonsoo Jang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →