Inventor · disambiguated record
Kevin Jeng
Also filed as: JENG KEVIN
5 granted patents·1 pending application·97 citations·filing 1993–2007
81Inventor score
Top patents by PatentIndex Score
6 records- 0187US7314819B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2005·Granted Jan 1, 2008·15 cites·23 claims
- 0276US7960831B2Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling sameINTEL CORP·Filed 2007·Granted Jun 14, 2011·7 cites·23 claims
- 0369US5567981ABonding pad structure having an interposed rigid layerINTEL CORP·Filed 1993·Granted Oct 22, 1996·40 cites·30 claims
- 0466US6265300B1Wire bonding surface and bonding methodINTEL CORP·Filed 1993·Granted Jul 24, 2001·35 cites·23 claims
- 0543US2006180945A1Forming a cap above a metal layerSESHAN KRISHNA·Filed 2006·Application pending·0 cites
- 0638US7056817B2Forming a cap above a metal layerINTEL CORP·Filed 2002·Granted Jun 6, 2006·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →